BGW200EG/01,515 NXP Semiconductors, BGW200EG/01,515 Datasheet - Page 65

• Manufacturer Part Number: BGW200EG/01,515
• Description: IC WLAN SIP MOD 802.11B 68HVQFN
• Manufacturer: NXP Semiconductors
• Series: BGW200r

Specifications of BGW200EG/01,515

• Frequency: 2.4GHz ~ 2.5GHz
• Modulation Or Protocol: DBPSK, DQPSK, CCK
• Applications: PDA's, Portable Audio/Video, Smartphones
• Power - Output: 8dBm ~ 18dBm
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Package / Case: 68-VQFN Exposed Pad, 68-HVQFN, 68-SQFN, 68-DHVQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Operating Temperature: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Current - Transmitting: -
• Current - Receiving: -
• Other names: 568-4015-2; 935279198515; BGW200EG/01-G

NXP Semiconductors
15. Package outline
Fig 40. Package outline SOT858-1 (HLLGA68)
BGW200EG_1
Product data sheet
HLLGA68: plastic thermal enhanced low profile land grid array package; 68 lands; body 10 x 15 x 1.3 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT858-1
VERSION
OUTLINE
max
1.4
A
0.32
0.28
b
L
land 1
index area
land 1
index area
10.1
9.9
D
E
h
IEC
L
E
1
h1
21
D
8.1
7.9
1
h
68
22
D
3.9
3.7
h1
JEDEC
15.1
14.9
e
E
D
e
D
1
REFERENCES
h
13.1
12.9
E
h
D
Rev. 01 — 18 July 2007
h1
b
E
4.2
4.0
h1
34
56
JEITA
0.65
35
55
e
B
e
0
w
v
7.8
e
M
M
A
E
e
1
2
C
C
A
e
13
2
B
scale
0.625
0.575
5
A
L
y
0.1
1
L
0
IEEE 802.11b System-in-Package
1
C
detail X
PROJECTION
EUROPEAN
0.1
10 mm
v
0.05
BGW200EG
C
w
X
y
0.05
y
© NXP B.V. 2007. All rights reserved.
ISSUE DATE
0.1
y
04-11-10
06-03-20
1
SOT858-1
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