BGW200EG/01,515 NXP Semiconductors, BGW200EG/01,515 Datasheet - Page 57

• Manufacturer Part Number: BGW200EG/01,515
• Description: IC WLAN SIP MOD 802.11B 68HVQFN
• Manufacturer: NXP Semiconductors
• Series: BGW200r

Specifications of BGW200EG/01,515

• Frequency: 2.4GHz ~ 2.5GHz
• Modulation Or Protocol: DBPSK, DQPSK, CCK
• Applications: PDA's, Portable Audio/Video, Smartphones
• Power - Output: 8dBm ~ 18dBm
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Package / Case: 68-VQFN Exposed Pad, 68-HVQFN, 68-SQFN, 68-DHVQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Operating Temperature: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Current - Transmitting: -
• Current - Receiving: -
• Other names: 568-4015-2; 935279198515; BGW200EG/01-G

NXP Semiconductors
BGW200EG_1
Product data sheet
Fig 27. Adjacent channel power ratio at gain setting CFh as a function of temperature
Fig 28. Alternate adjacent channel power ratio at gain setting CFh as a function of temperature
ACPR
ACPR
(dBr)
(dBr)
(1) V
(2) V
(3) V
(1) V
(2) V
(3) V
a. 11 Mbit/s modulation in channel 1
a. 11 Mbit/s modulation in channel 1
alt
30
31
32
33
34
35
49
51
53
55
57
40
40
DD
DD
DD
DD
DD
DD
= 2.7 V
= 2.85 V
= 3.0 V
= 3.0 V
= 2.85 V
= 2.7 V
(3)
(2)
(1)
10
10
(2)
(3)
(1)
60
60
T
T
amb
amb
001aad217
001aad219
( C)
( C)
110
110
Rev. 01 — 18 July 2007
ACPR
ACPR
(dBr)
(dBr)
b. 11 Mbit/s modulation in channel 11
b. 11 Mbit/s modulation in channel 11
alt
30
31
32
33
34
35
49
51
53
55
57
40
40
IEEE 802.11b System-in-Package
10
10
(2)
(1)
(3)
BGW200EG
60
60
T
T
© NXP B.V. 2007. All rights reserved.
amb
amb
001aad218
001aad220
(1)
(2)
(3)
( C)
( C)
110
110
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