BGW200EG/01,515 NXP Semiconductors, BGW200EG/01,515 Datasheet - Page 68

• Manufacturer Part Number: BGW200EG/01,515
• Description: IC WLAN SIP MOD 802.11B 68HVQFN
• Manufacturer: NXP Semiconductors
• Series: BGW200r

Specifications of BGW200EG/01,515

• Frequency: 2.4GHz ~ 2.5GHz
• Modulation Or Protocol: DBPSK, DQPSK, CCK
• Applications: PDA's, Portable Audio/Video, Smartphones
• Power - Output: 8dBm ~ 18dBm
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Package / Case: 68-VQFN Exposed Pad, 68-HVQFN, 68-SQFN, 68-DHVQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Operating Temperature: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Current - Transmitting: -
• Current - Receiving: -
• Other names: 568-4015-2; 935279198515; BGW200EG/01-G

NXP Semiconductors
BGW200EG_1
Product data sheet
16.2.1 Solder paste
16.2.2 Reflow profile
16.2 Soldering
Standard (no-clean) Sn/Pb (63 % / 37 %) or Pb-free solder pastes should be used for
soldering the package. Solder pastes should be selected based on their printing and
reflow behavior. For Pb-free solder paste it is recommended to use ‘SAC’ type solder
paste (e.g. SnAg3.8Cu0.7) with melting point of 217 C.
An industrial convection reflow oven should be used to mount the packages. The profile
depends on the printed-circuit board and other components that are used in the customer
application. For maximum peak temperature JEDEC specification should be followed.
Following reflow profile and constraints are recommended for eutectic Sn/Pb and Pb-free
reflow solders.
Fig 43. Reflow temperature profile
temperature
25 C
T
T
P
L
T
T
S(max)
S(min)
Rev. 01 — 18 July 2007
preheat
25 C to T
t
S
P
ramp-up
IEEE 802.11b System-in-Package
BGW200EG
t
L
ramp-down
© NXP B.V. 2007. All rights reserved.
critical zone
time
T
001aad234
L
to T
P
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