BGW200EG/01,515 NXP Semiconductors, BGW200EG/01,515 Datasheet - Page 60

• Manufacturer Part Number: BGW200EG/01,515
• Description: IC WLAN SIP MOD 802.11B 68HVQFN
• Manufacturer: NXP Semiconductors
• Series: BGW200r

Specifications of BGW200EG/01,515

• Frequency: 2.4GHz ~ 2.5GHz
• Modulation Or Protocol: DBPSK, DQPSK, CCK
• Applications: PDA's, Portable Audio/Video, Smartphones
• Power - Output: 8dBm ~ 18dBm
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Package / Case: 68-VQFN Exposed Pad, 68-HVQFN, 68-SQFN, 68-DHVQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Operating Temperature: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Current - Transmitting: -
• Current - Receiving: -
• Other names: 568-4015-2; 935279198515; BGW200EG/01-G

NXP Semiconductors
BGW200EG_1
Product data sheet
Fig 33. SPI1 master timing (CPHA = 0)
Fig 34. SPI1 master timing (CPHA = 1)
(CPOL = 0)
(CPOL = 1)
(CPOL = 0)
(CPOL = 1)
SPI_SS_N
SPI_MOSI
SPI_MISO
SPI_SS_N
SPI_MOSI
SPI_MISO
SPI_SCK
SPI_SCK
SPI_SCK
SPI_SCK
(output)
(output)
(input)
(input)
t
d(o)(SPI_MOSI)
Rev. 01 — 18 July 2007
t
su(SPI_MISO)
t
d(o)(SPI_MOSI)
t
su(SPI_MISO)
T
T
SPI_SCK
SPI_SCK
IEEE 802.11b System-in-Package
t
clk(L)
t
t
h(i)(SPI_MISO)
h(o)(SPI_MOSI)
t
clk(H)
BGW200EG
t
t
h(i)(SPI_MISO)
h(o)(SPI_MOSI)
© NXP B.V. 2007. All rights reserved.
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