BGW200EG/01,515 NXP Semiconductors, BGW200EG/01,515 Datasheet - Page 70

• Manufacturer Part Number: BGW200EG/01,515
• Description: IC WLAN SIP MOD 802.11B 68HVQFN
• Manufacturer: NXP Semiconductors
• Series: BGW200r

Specifications of BGW200EG/01,515

• Frequency: 2.4GHz ~ 2.5GHz
• Modulation Or Protocol: DBPSK, DQPSK, CCK
• Applications: PDA's, Portable Audio/Video, Smartphones
• Power - Output: 8dBm ~ 18dBm
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Package / Case: 68-VQFN Exposed Pad, 68-HVQFN, 68-SQFN, 68-DHVQFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Operating Temperature: -
• Sensitivity: -
• Memory Size: -
• Data Rate - Maximum: -
• Current - Transmitting: -
• Current - Receiving: -
• Other names: 568-4015-2; 935279198515; BGW200EG/01-G

NXP Semiconductors
17. Moisture sensitivity level
18. Chemical content
BGW200EG_1
Product data sheet
16.3.2 Site redress
16.3.3 Solder paste application
16.3.4 Repair
After the component is removed, the PCB solder land needs to be cleaned properly. It is
best to use a combination of a blade-style conductive tool and desoldering braid. The
width of the blade should be matched to the maximum width of the footprint and the blade
temperature should be low enough not to cause any damage to the circuit board. Flux
residues on the PCB can be removed using IsoPropyl Alcohol (IPA).
It is recommended to reapply solder by dispensing or stencil printing. The amount of
solder applied on the terminals should be in the order of 0.08 mg. In case of dispensing, a
gage 27 (0.2 mm opening) needle should be used with 0.3 s to 0.4 s shot at 4 bar. For
stencil printing a mini stencil of 0.1 mm thickness can be used if application allows room
for it.
A BGA repair station has a vacuum pick-up tool and usually some component alignment
possibilities. A split-beam optical system should be used to align the component on the
solder lands. This will form an image of leads overlaid on the mating footprint and aid in
proper alignment. The placement machine should have the capability of allowing fine
adjustments in X, Y, and rotational axes. Manual placement is not recommended,
although the package allows 0.1 mm to 0.15 mm misplacement.
For resoldering of the newly placed component the same profile of bottom and top heating
should be applied as for soldering.
Moisture Sensitivity Level (MSL) of the BGW200EG is determined in accordance with
JEDEC standard J-STD-020C.
The BGW200EG has MSL level 4 with a floor life of 72 h after opening of the drypack.
The BGW200EG is RoHS 2006 compliant and lead free (0 % Pb).
Rev. 01 — 18 July 2007
IEEE 802.11b System-in-Package
BGW200EG
© NXP B.V. 2007. All rights reserved.
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