ADUC7039BCP6Z-RL Analog Devices Inc, ADUC7039BCP6Z-RL Datasheet - Page 6

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ADUC7039BCP6Z-RL

Manufacturer Part Number
ADUC7039BCP6Z-RL
Description
Flash 64k ARM7 Dual 16-Bit ADC LIN I.C.
Manufacturer
Analog Devices Inc
Series
MicroConverter® ADuC7xxxr
Datasheet

Specifications of ADUC7039BCP6Z-RL

Core Processor
ARM7
Core Size
16/32-Bit
Speed
20.48MHz
Connectivity
LIN, SPI
Peripherals
POR, Temp Sensor, WDT
Number Of I /o
6
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3.5 V ~ 18 V
Data Converters
A/D 2x16b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 115°C
Package / Case
32-LFCSP
Lead Free Status / RoHS Status
Lead free by exemption / RoHS compliant by exemption
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free by exemption / RoHS compliant by exemption

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ADUC7039BCP6Z-RL
Manufacturer:
NS/国半
Quantity:
20 000
ADuC7039
Parameter
PACKAGE THERMAL SPECIFICATIONS
POWER REQUIREMENTS
REG_DVDD, REG_AVDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
Not guaranteed by production test but by design and/or characterization data at production release.
Valid for current ADC gain setting of PGA up to 64.
These numbers include temperature drift.
The offset error drift is included in the offset error. This typical specification is an indicator of the offset error due to temperature drift. This typical value is the mean of
the temperature drift characterization data distribution.
Includes internal reference temperature drift.
User system calibration removes this error at a given temperature and at a given gain on the current channel.
The gain drift is included in the total gain error. This typical specification is an indicator of the gain error due to temperature drift. This typical value is the mean of the
temperature drift characterization data distribution.
Voltage channel specifications include resistive attenuator input stage.
RMS noise is referred to voltage attenuator input; for example, at f
Valid after an initial self calibration.
It is possible to extend the ADC input range by up to 10% by modifying the factory set value of the gain calibration register or using system calibration. This approach
In ADC low power mode, the input range is fixed at ±2.34375 mV.
Valid for a differential input less than 10 mV.
The absolute value of the voltage of VTEMP and GND_SW must be 100mV minimum, for accurate operation of the T-ADC.
Measured using box method.
The long-term stability specification is noncumulative. The drift in subsequent 1000 hour periods is significantly lower than in the first 1000 hour period.
Die temperature.
Endurance is qualified to 10,000 cycles, as per JEDEC Std. 22 Method A117 and measured at −40°C, +25°C, and +125°C. Typical endurance at 25°C is 170,000 cycles.
Retention lifetime equivalent at junction temperature (T
These numbers are not production tested but are supported by LIN compliance testing.
Thermal impedance can be used to calculate the thermal gradient from ambient to die temperature.
Internal regulated supply available at REG_DVDD (I
Typical additional supply current consumed during Flash/EE memory program and erase cycles is 7 mA and 5 mA, respectively.
input referred noise figures.
can also be used to reduce the ADC input range (LSB size).
Thermal Impedance (θ
Power Supply Voltages
VDD (Battery Supply)
Power Consumption
I
I
I
I
I
I
DD
DD
DD
DD
DD
DD
D3
D4
t
t
(MCU Normal Mode)
(MCU Powered Down)
(MCU Powered Down)
(Current ADC)
(Voltage/Temperature ADC)
(Precision Oscillator)
RX_PDR
RX_SYM
1, 20
1, 20
1, 20
1, 20
22
1
JA
23
)
21
1
1
Test Conditions/Comments
TH
TH
V
t
D3 = t
TH
TH
V
t
D4 = t
Propagation delay of receiver
Symmetry of receiver propagation delay rising edge,
with respect to falling edge (t
32-lead CSP, stacked die
ADC off (20.48 MHz)
ADC off (10.24 MHz)
ADC low power mode, measured over an ambient
temperature range of T
conversion
Precision oscillator turned off, ADC off
Average current, measured with wake-up and watchdog
timers clocked from low power oscillator (−40°C to +85°C)
Average current, measured with wake-up and watchdog
timers clocked from low power oscillator over an ambient
temperature range of −10°C to +40°C
BIT
BIT
DD
DD
REC(MAX)
DOM(MAX)
REC(min)
DOM(min)
= 96 μs
= 96 μs
= 7.0 V … 18 V
= 7.0 V ... 18 V
BUS_REC(MIN)
BUS_REC(MAX)
= 0.389 × VBAT
SOURCE
= 0.778 × VBAT
= 0.251 × VBAT
= 0.616 × VBAT
J
= 5 mA) and REG_AVDD (I
) = 85°C, as per JEDEC Std. 22 Method A117. Retention lifetime derates with junction temperature.
/(2 × t
/(2 × t
BIT
BIT
ADC
)
A
)
= −10°C to +40°C, continuous ADC
= 1 kHz, typical rms noise at the ADC input is 7.5 μV, scaled by the attenuator (24) yields these
Rev. B | Page 6 of 92
RX_SYM
= t
RF_PDR
SOURCE
− t
=1 mA).
RX_PDF
)
Min
0.417
−2
3.5
2.45
Typ
32
2.6
10
7.5
750
95
95
1.7
0.5
400
18
Max
0.590
6
+2
2.75
20
16
1000
300
175
Unit
μs
μs
°C/W
V
V
mA
mA
μA
μA
μA
mA
mA
μA

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