LPC4350FET256,551 NXP Semiconductors, LPC4350FET256,551 Datasheet - Page 126

• Manufacturer Part Number: LPC4350FET256,551
• Description: IC MCU 32BIT 256LBGA
• Manufacturer: NXP Semiconductors
• Series: LPC43xxr

Specifications of LPC4350FET256,551

• Core Processor: ARM® Cortex™-M4/M0
• Core Size: 32-Bit Dual-Core
• Speed: 150MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, SD/MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 146
• Program Memory Size: -
• Program Memory Type: ROMless
• Eeprom Size: -
• Ram Size: 264K x 8
• Voltage - Supply (vcc/vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-LBGA
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

NXP Semiconductors
LPC4350_30_20_10
Objective data sheet
13.3 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of C
accordingly to the increase in parasitics of the PCB layout.
All information provided in this document is subject to legal disclaimers.
Rev. 2.1 — 23 September 2011
32-bit ARM Cortex-M4/M0 microcontroller
x1
and C
LPC4350/30/20/10
x2
should be chosen smaller
x1
, C
x2
, and C
© NXP B.V. 2011. All rights reserved.
x3
in case of
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