LPC4350FET256,551 NXP Semiconductors, LPC4350FET256,551 Datasheet - Page 133

• Manufacturer Part Number: LPC4350FET256,551
• Description: IC MCU 32BIT 256LBGA
• Manufacturer: NXP Semiconductors
• Series: LPC43xxr

Specifications of LPC4350FET256,551

• Core Processor: ARM® Cortex™-M4/M0
• Core Size: 32-Bit Dual-Core
• Speed: 150MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, SD/MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 146
• Program Memory Size: -
• Program Memory Type: ROMless
• Eeprom Size: -
• Ram Size: 264K x 8
• Voltage - Supply (vcc/vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-LBGA
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

NXP Semiconductors
15. Soldering
LPC4350_30_20_10
Objective data sheet
Fig 48. Reflow soldering of the LBGA256 package
Footprint information for reflow soldering of LBGA256 package
DIMENSIONS in mm
1.00
P
0.450
SL
0.450
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
SP
Hy
0.600
SR
P
17.500 17.500
Hx
Refer to the package outline drawing for actual layout
Hy
All information provided in this document is subject to legal disclaimers.
P
Rev. 2.1 — 23 September 2011
Generic footprint pattern
Hx
32-bit ARM Cortex-M4/M0 microcontroller
LPC4350/30/20/10
detail X
SR
SL
SP
see detail X
© NXP B.V. 2011. All rights reserved.
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