LPC4350FET256,551 NXP Semiconductors, LPC4350FET256,551 Datasheet - Page 90

• Manufacturer Part Number: LPC4350FET256,551
• Description: IC MCU 32BIT 256LBGA
• Manufacturer: NXP Semiconductors
• Series: LPC43xxr

Specifications of LPC4350FET256,551

• Core Processor: ARM® Cortex™-M4/M0
• Core Size: 32-Bit Dual-Core
• Speed: 150MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, SD/MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 146
• Program Memory Size: -
• Program Memory Type: ROMless
• Eeprom Size: -
• Ram Size: 264K x 8
• Voltage - Supply (vcc/vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-LBGA
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

NXP Semiconductors
9. Thermal characteristics
Table 7.
V
LPC4350_30_20_10
Objective data sheet
Symbol
T
DD
j(max)
= 2.2 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
•
•
•
j

=
T
R
P
40
amb
D
T
th(j-a)
amb

= sum of internal and I/O power dissipation
C to +85
= ambient temperature (C),
+
= the package junction-to-ambient thermal resistance (C/W)

P
D
All information provided in this document is subject to legal disclaimers.

Conditions

C unless otherwise specified;
R
th j a
Rev. 2.1 — 23 September 2011

–


j
(C), can be calculated using the following
32-bit ARM Cortex-M4/M0 microcontroller
Min
-
DD
and V
LPC4350/30/20/10
DD
Typ
-
. The I/O power dissipation of
Max
<tbd>
© NXP B.V. 2011. All rights reserved.
Unit
90 of 145
C
(1)