LPC4350FET256,551 NXP Semiconductors, LPC4350FET256,551 Datasheet - Page 137
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
LPC4350FET256,551
Manufacturer Part Number
LPC4350FET256,551
Description
IC MCU 32BIT 256LBGA
Manufacturer
NXP Semiconductors
Series
LPC43xxr
Datasheet
1.LPC4310FET100551.pdf
(145 pages)
Specifications of LPC4350FET256,551
Core Processor
ARM® Cortex™-M4/M0
Core Size
32-Bit Dual-Core
Speed
150MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, SD/MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Number Of I /o
146
Program Memory Size
-
Program Memory Type
ROMless
Eeprom Size
-
Ram Size
264K x 8
Voltage - Supply (vcc/vdd)
2.2 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-LBGA
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC4350FET256,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
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NXP Semiconductors
LPC4350_30_20_10
Objective data sheet
Fig 52. Reflow soldering of the TFBGA100 package
Footprint information for reflow soldering of TFBGA100 package
DIMENSIONS in mm
0.80
P
0.330
SL
0.400
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
SP
Hy
0.480
SR
P
9.400
Hx
9.400
Refer to the package outline drawing for actual layout
Hy
All information provided in this document is subject to legal disclaimers.
P
Rev. 2.1 — 23 September 2011
Generic footprint pattern
Hx
32-bit ARM Cortex-M4/M0 microcontroller
LPC4350/30/20/10
detail X
SR
SL
SP
see detail X
© NXP B.V. 2011. All rights reserved.
sot926-1_fr
SOT926-1
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