LPC4350FET256,551 NXP Semiconductors, LPC4350FET256,551 Datasheet - Page 5

• Manufacturer Part Number: LPC4350FET256,551
• Description: IC MCU 32BIT 256LBGA
• Manufacturer: NXP Semiconductors
• Series: LPC43xxr

Specifications of LPC4350FET256,551

• Core Processor: ARM® Cortex™-M4/M0
• Core Size: 32-Bit Dual-Core
• Speed: 150MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, SD/MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 146
• Program Memory Size: -
• Program Memory Type: ROMless
• Eeprom Size: -
• Ram Size: 264K x 8
• Voltage - Supply (vcc/vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-LBGA
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

NXP Semiconductors
4. Ordering information
Table 1.
Table 2.
LPC4350_30_20_10
Objective data sheet
Type number
LPC4350FET256
LPC4350FET180
LPC4350FBD208 LQFP208
LPC4330FET256
Type number
LPC4350FET256
LPC4350FET180
LPC4350FBD208 264 kB
LPC4330FET256
LPC4330FET180
LPC4330FET100
LPC4330FBD144 264 kB
LPC4320FET100
LPC4320FBD144 200 kB
LPC4320FBD100 168 kB
LPC4310FET100
LPC4310FBD144 168 kB
LPC4330FET180
LPC4330FET100
LPC4330FBD144 LQFP144
LPC4320FET100
LPC4320FBD144 LQFP144
LPC4320FBD100 LQFP100
LPC4310FET100
LPC4310FBD144 LQFP144
Ordering information
Ordering options
4.1 Ordering options
Package
Name
LBGA256
TFBGA180 Thin fine-pitch ball grid array package; 180 balls
LBGA256
TFBGA180 Thin fine-pitch ball grid array package; 180 balls
TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm
TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm
TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm
Total
SRAM
264 kB
264 kB
264 kB
264 kB
264 kB
200 kB
168 kB
LCD Ethernet USB0
yes
yes
yes
no
no
no
no
no
no
no
no
no
Description
Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm
Plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm
Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm
Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm
Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm
Plastic low profile quad flat package; 100 leads; body 14  14  1.4 mm
Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm
yes
yes
yes
yes
yes
yes
yes
no
no
no
no
no
All information provided in this document is subject to legal disclaimers.
Rev. 2.1 — 23 September 2011
(Host,
Device,
OTG)
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
no
no
USB1
(Host,
Device)/
ULPI
interface
yes/yes
yes/yes
yes/yes
yes/yes
yes/yes
yes/no
yes/no
no
no
no
no
no
ADC
channels
4
8
5
4
8
8
8
8
8
8
8
4
32-bit ARM Cortex-M4/M0 microcontroller
PWM
yes
yes
yes
yes
yes
no
yes
no
yes
no
no
yes
LPC4350/30/20/10
QEI
yes
yes
yes
yes
yes
no
no
no
no
no
no
no
GPIO
164
118
142
164
118
49
83
49
83
49
49
83
© NXP B.V. 2011. All rights reserved.
Package
LBGA256
TFBGA180
LQFP208
LBGA256
TFBGA180
TFBGA100
LQFP144
TFBGA100
LQFP144
LQFP100
TFBGA100
LQFP144
Version
SOT740-2
SOT570-3
SOT459-1
SOT740-2
SOT570-3
SOT926-1
SOT486-1
SOT926-1
SOT486-1
SOT407-1
SOT926-1
SOT486-1
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