LPC4350FET256,551 NXP Semiconductors, LPC4350FET256,551 Datasheet - Page 135

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LPC4350FET256,551

Manufacturer Part Number
LPC4350FET256,551
Description
IC MCU 32BIT 256LBGA
Manufacturer
NXP Semiconductors
Series
LPC43xxr
Datasheet

Specifications of LPC4350FET256,551

Core Processor
ARM® Cortex™-M4/M0
Core Size
32-Bit Dual-Core
Speed
150MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, SD/MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT
Number Of I /o
146
Program Memory Size
-
Program Memory Type
ROMless
Eeprom Size
-
Ram Size
264K x 8
Voltage - Supply (vcc/vdd)
2.2 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-LBGA
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC4350FET256,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
LPC4350_30_20_10
Objective data sheet
Fig 50. Reflow soldering of the LQFP208 package
Footprint information for reflow soldering of LQFP208 package
DIMENSIONS in mm
0.500
P1
0.560
P2
31.300 31.300 28.300 28.300
Hy
Ax
solder land
occupied area
Gy
Ay
C
Bx
By
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
P2
1.500
C
D2 (8×)
Rev. 2.1 — 23 September 2011
0.280
Generic footprint pattern
D1
0.400 28.500 28.500 31.550 31.550
P1
D2
Hx
Gx
Bx
Ax
Gx
(0.125)
Gy
32-bit ARM Cortex-M4/M0 microcontroller
Hx
D1
LPC4350/30/20/10
Hy
By
© NXP B.V. 2011. All rights reserved.
Ay
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SOT459-1
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