XC2VP70 Xilinx, Inc., XC2VP70 Datasheet - Page 313

• Manufacturer Part Number: XC2VP70
• Description: Virtex-ii Pro Field Programmable Gate Array
• Manufacturer: Xilinx, Inc.

FF1704 Flip-Chip Fine-Pitch BGA Package
FF1704 Flip-Chip Fine-Pitch BGA Package
As shown in
fine-pitch BGA package. Following this table are the
pitch).
Table 13: FF1704 — XC2VP70, XC2VP100, and XC2VP125
202
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Table
13, XC2VP70, XC2VP100, and XC2VP125 Virtex-II Pro devices are available in the FF1704 flip-chip
IO_L03P_0/VREF_0
IO_L09P_0/VREF_0
IO_L27P_0/VREF_0
IO_L01N_0/VRP_0
IO_L01P_0/VRN_0
IO_L05_0/No_Pair
Pin Description
IO_L02N_0
IO_L03N_0
IO_L06N_0
IO_L07N_0
IO_L08N_0
IO_L09N_0
IO_L19N_0
IO_L20N_0
IO_L21N_0
IO_L25N_0
IO_L26N_0
IO_L27N_0
IO_L28N_0
IO_L29N_0
IO_L30N_0
IO_L02P_0
IO_L06P_0
IO_L07P_0
IO_L08P_0
IO_L19P_0
IO_L20P_0
IO_L21P_0
IO_L25P_0
IO_L26P_0
IO_L28P_0
IO_L29P_0
IO_L30P_0
www.xilinx.com
1-800-255-7778
FF1704 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm
Pin Number
M30
G34
H34
C34
D34
H33
G33
D33
H32
C33
C32
H31
G31
D31
G30
H30
F34
E34
K32
F33
E33
E32
F32
K31
F31
E31
K30
J33
J32
L31
J31
L30
J30
XC2VP70
No Connects
DS083-4 (v2.5.5) August 25, 2003
XC2VP100
Advance Product Specification
XC2VP125
R