MPC8379E-RDBA Freescale Semiconductor, MPC8379E-RDBA Datasheet - Page 104

• Manufacturer Part Number: MPC8379E-RDBA
• Description: BOARD REF DESIGN MPC8379E
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II™ PROr
• Type: MPUr

Specifications of MPC8379E-RDBA

• Contents: Board
• Memory Type: Flash, SDRAM
• Interface Type: Ethernet, USB, PCI, UART
• Board Size: 170 mm x 170 mm
• Product: Modules
• Silicon Manufacturer: Freescale
• Core Architecture: Power Architecture
• Core Sub-architecture: PowerQUICC
• Silicon Core Number: MPC83xx
• Silicon Family Name: PowerQUICC II PRO
• Rohs Compliant: Yes
• For Use With/related Products: MPC8379E
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Thermal
23 Thermal
This section describes the thermal specifications of the MPC8379E.
23.1
Table 78
23.2
For the following sections, P
23.2.1
An estimation of the chip junction temperature, T
104
Junction-to-ambient natural convection on single layer board (1s)
Junction-to-ambient natural convection on four layer board (2s2p)
Junction-to-ambient (at 200 ft/min) on single layer board (1s)
Junction-to-ambient (at 200 ft/min) on four layer board (2s2p)
Junction-to-board thermal
Junction-to-case thermal
Junction-to-package natural convection on top
Note:
1
2
3
4
5
6
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
provides the package thermal characteristics for the 689 31 × 31mm TePBGA II package.
Thermal Characteristics
Thermal Management Information
Estimation of Junction Temperature with Junction-to-Ambient
Thermal Resistance
T
where:
MPC8379E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
J
= T
T
T
R
A
Table 78. Package Thermal Characteristics for TePBGA II
A
J
θ
+ (R
JA
= junction temperature (°C)
= ambient temperature for the package (°C)
Parameter
D
= junction to ambient thermal resistance (°C/W)
θ
= (V
JA
× P
DD
D
)
× I
DD
) + P
I/O
J
, can be obtained from the equation:
where P
I/O
is the power dissipation of the I/O drivers.
Symbol
R
R
R
R
R
R
ψ
θJMA
θJMA
θJB
θJC
θJA
θJA
JT
Value
21
15
16
12
8
6
6
Freescale Semiconductor
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Notes
1, 2, 3
1, 2
1, 3
1, 3
4
5
6