MPC8379E-RDBA Freescale Semiconductor, MPC8379E-RDBA Datasheet - Page 107

• Manufacturer Part Number: MPC8379E-RDBA
• Description: BOARD REF DESIGN MPC8379E
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II™ PROr
• Type: MPUr

Specifications of MPC8379E-RDBA

• Contents: Board
• Memory Type: Flash, SDRAM
• Interface Type: Ethernet, USB, PCI, UART
• Board Size: 170 mm x 170 mm
• Product: Modules
• Silicon Manufacturer: Freescale
• Core Architecture: Power Architecture
• Core Sub-architecture: PowerQUICC
• Silicon Core Number: MPC83xx
• Silicon Family Name: PowerQUICC II PRO
• Rohs Compliant: Yes
• For Use With/related Products: MPC8379E
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 79
standard JEDEC environment, per JESD 51-6.
Heat sink vendors include the following:
Freescale Semiconductor
Aavid Thermalloy
www.aavidthermalloy.com
Alpha Novatech
www.alphanovatech.com
International Electronic Research Corporation (IERC)
www.ctscorp.com
Millennium Electronics (MEI)
www.mei-thermal.com
Heat Sink Assuming Thermal Grease
shows the heat sink thermal resistance for TePBGA II package with heat sinks, simulated in a
Wakefield, 53
AAVID 30
AAVID 31
AAVID 43
Table 79. Thermal Resistance with Heat Sink in Open Flow (TePBGA II)
×
×
×
MPC8379E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
41
30
×
35
×
53
×
×
16.5mm Pin Fin
9.4 mm Pin Fin
×
23 mm Pin Fin
25 mm Pin Fin
Natural Convection
Natural Convection
Natural Convection
Natural Convection
Air Flow
0.5 m/s
0.5 m/s
0.5 m/s
0.5 m/s
1 m/s
2 m/s
4 m/s
1 m/s
2 m/s
4 m/s
1 m/s
2 m/s
4 m/s
1 m/s
2 m/s
4 m/s
Thermal Resistance
(°/W)
13.1
10.6
11.1
11.3
9.3
8.2
7.5
8.5
7.7
7.2
6.8
9.0
7.8
7.0
6.5
9.7
7.7
6.8
6.4
6.1
Thermal
107