m21262 Mindspeed Technologies, m21262 Datasheet - Page 43

• Manufacturer Part Number: m21262
• Description: Cdr/reclocker With 4 1 Input Multiplexer
• Manufacturer: Mindspeed Technologies

Product Specifications
2.6
Package Drawings and Surface Mount Assembly Details
The M21262 is assembled in 72-pin 10 mm x 10 mm MicroLeadFrame (MLF) packages. This is a plastic
encapsulated package with a copper leadframe. The MLF is a leadless package with lands on the bottom surface
of the package.
The exposed die paddle serves as the IC ground (Vss), and the primary means of thermal dissipation. This die
paddle should be soldered to the PCB. A cross-section of the MLF package can be found in
Figure
2-7.
Figure 2-7.
Cross-Section of MLF Package
Mold Compound
Ag Plating
Die
Solder
Plating
Gold Wire
Down Bond
Ground Bond
Exposed Die
Cu Leadframe
Die Attach Material
Paddle
®
Mindspeed Technologies
21262-DSH-001-C
35
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