m21262 Mindspeed Technologies, m21262 Datasheet - Page 48
m21262
Manufacturer Part Number
m21262
Description
Cdr/reclocker With 4 1 Input Multiplexer
Manufacturer
Mindspeed Technologies
Datasheet
1.M21262.pdf
(71 pages)
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Product Specifications
The pad length dimensions should account for component tolerances, PCB tolerances, and placement tolerances.
At a minimum, the pad should extend at least 0.1 mm on the outside and 0.05 mm on the inside, as shown in
Figure
2-12.
Figure 2-12. PCB Pad Extensions
.1 mm
.05m m
PCB Pad
To efficiently dissipate heat from the M21262, a thermal pad with thermal vias should be used on the PCB. An
example of a thermal pad with a 4x4 via array is shown in
Figure
2-13. The thermal vias provide a heat conduction
path to inner and/or bottom layers of the PCB. The larger the via array, the lower the thermal resistance (θ
) . It is
ja
recommended to use thermal vias with 1.0 to 1.2 mm pitch with 0.3 to 0.33 mm via diameter.
Figure 2-13. Recommended Via Array for Thermal Pad
For further details please refer to the relevant application note from package vendor Amkor (see list of references at
the end of this document). Much of the material in this section has been adopted from the Amkor SMT application
note.
®
Mindspeed Technologies
21262-DSH-001-C
40
Mindspeed Proprietary and Confidential
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