MC68HC908QY2 MOTOROLA [Motorola, Inc], MC68HC908QY2 Datasheet - Page 225

• Manufacturer Part Number: MC68HC908QY2
• Description: Microcontrollers
• Manufacturer: MOTOROLA [Motorola, Inc]

19.5 16-Pin Plastic Dual In-Line Package (Case #648D)
19.6 16-Pin Small Outline Integrated Circuit Package (Case #751G)
MOTOROLA
MC68HC908QY4•MC68HC908QT4•MC68HC908QY2•MC68HC908QT2•MC68HC908QY1•MC68HC908QT1
16
1
16
1
H
0.25
14X
-A-
G
16X
M
D
e
B
T
A
D
F
S
16 PL
9
8
0.25 (0.010)
B
9
8
S
-B-
S
A
B
T
C
SEATING
PLANE
K
M
-T-
T
Mechanical Specifications
B
SEATING
PLANE
S
A
C
S
J
L
q
16-Pin Plastic Dual In-Line Package (Case #648D)
M
NOTES:
1.
2.
3.
4.
5.
6.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
MOLD FLASH OR PROTRUSIONS SHALL
NOT EXCEED 0.25 (0.010).
ROUNDED CORNERS OPTIONAL.
DIM
G
M
A
B
C
D
F
H
J
K
L
S
NOTES:
1.
2.
3.
4.
5.
0.740
0.245
0.145
0.015
0.050
0.008
0.120
0.295
0.015
DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND
TOLERANCES PER ASME Y14.5M, 1994.
DIMENSIONS D AND E DO NOT INLCUDE
MOLD PROTRUSION.
MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
MIN
0.100 BSC
0.050 BSC
DIM
A1
0
A
B
C
D
E
H
INCHES
e
h
L
q
10.15
10.05
MILLIMETERS
0.760 18.80
0.260
0.175
0.021
0.070
0.015
0.140
0.305
0.035
2.35
0.10
0.35
0.23
7.40
0.25
0.40
MIN
MAX
10
1.27 BSC
Mechanical Specifications
0
10.45
10.55
MILLIMETERS
MAX
2.65
0.25
0.49
0.32
7.60
0.75
1.00
6.23
3.69
0.39
1.27
0.21
3.05
7.50
0.39
MIN
2.54 BSC
1.27 BSC
7
0
19.30
MAX
6.60
4.44
0.53
1.77
0.38
3.55
7.74
0.88
10
225