DSPIC30F6010-30I/PF Microchip Technology, DSPIC30F6010-30I/PF Datasheet - Page 221

• Manufacturer Part Number: DSPIC30F6010-30I/PF
• Description: IC DSPIC MCU/DSP 144K 80TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F6010-30I/PF

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 68
• Program Memory Size: 144KB (48K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-TQFP, 80-VQFP
• Core Frequency: 40MHz
• Core Supply Voltage: 5.5V
• Embedded Interface Type: CAN, I2C, SPI, UART
• No. Of I/o's: 68
• Flash Memory Size: 144KB
• Supply Voltage Range: 2.5V To 5.5V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300019 - BOARD DEMO DSPICDEM 80L STARTERAC164314 - MODULE SKT FOR PM3 80PFDM300020 - BOARD DEV DSPICDEM MC1 MOTORCTRLAC30F001 - MODULE SOCKET DSPIC30F 80TQFPXLT80PT2 - SOCKET TRANSITION ICE 80TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: DSPIC30F601030IPF

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
© 2006 Microchip Technology Inc.
Architecture
Trademark
Example:
dsPIC30F6010AT-30I/PF = 30 MIPS, Industrial temp., TQFP package, Rev. A
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Device ID
Flash
d s P I C 3 0 F 6 0 1 0 AT - 3 0 I / P F - 0 0 0
Temperature
I = Industrial -40°C to +85°C
E = Extended High Temp -40°C to +125°C
dsPIC30F6010
PF = TQFP 14x14
S
W
A,B,C… = Revision Level
Custom ID (3 digits) or
Engineering Sample (ES)
= Die (Waffle Pack)
= Die (Wafers)
T = Tape and Reel
Package
DS70119E-page 219
Speed
20 = 20 MIPS
30 = 30 MIPS