AT91RM9200-QU-002 Atmel, AT91RM9200-QU-002 Datasheet - Page 204

• Manufacturer Part Number: AT91RM9200-QU-002
• Description: IC ARM9 MCU 208 PQFP
• Manufacturer: Atmel
• Series: AT91SAMr

Specifications of AT91RM9200-QU-002

• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 180MHz
• Connectivity: EBI/EMI, Ethernet, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: POR
• Number Of I /o: 122
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: ROM
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 1.95 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-MQFP, 208-PQFP
• Processor Series: AT91Rx
• Core: ARM7TDMI
• Data Bus Width: 32 bit
• Data Ram Size: 16 KB
• Interface Type: 2-Wire, EBI, I2S, SPI, UART, USART
• Maximum Clock Frequency: 180 MHz
• Number Of Programmable I/os: 122
• Number Of Timers: 10 bit
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: AT91SAM-ICE, AT91-ISP, AT91RM9200-EK
• Minimum Operating Temperature: - 40 C
• Eeprom Memory: 0 Bytes
• Input Output: 122
• Interface: EBI/EMI, UART/USART
• Ios: 122
• Memory Type: ROM
• Number Of Bits: 32
• Package Type: 208-pin PQFP
• Programmable Memory: 128K Bytes
• Timers: 3-16-bit
• Voltage, Range: 1.65-1.95 V
• Cpu Family: 91R
• Device Core: ARM920T
• Device Core Size: 32b
• Frequency (max): 180MHz
• Total Internal Ram Size: 16KB
• # I/os (max): 122
• Number Of Timers - General Purpose: 6
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Supply Voltage (max): 1.95/3.6V
• Operating Supply Voltage (min): 1.65/3V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 208
• For Use With: AT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

19.6.5.2
Figure 19-8. Low-power Mode Behavior
204
SDCKE
D[31:0]
A[12:0]
SDCS
SDCK
(input)
RAS
CAS
AT91RM9200
Low-power Mode
Row n
Low-power mode is used in power-down mode, i.e., when no access to the SDRAM device is
possible. In this mode, power consumption is greater than in self-refresh mode. This state is sim-
ilar to normal mode (No low-power mode/No self-refresh mode), but the SDCKE pin is low and
the input and output buffers are deactivated as soon as the SDRAM device is no longer accessi-
ble. In contrast to self-refresh mode, the SDRAM device cannot remain in low-power mode
longer than the refresh period (64 ms for a whole device refresh operation). As no auto-refresh
operations are performed in this mode, the SDRAM Controller carries out the refresh operation.
In order to exit low-power mode, a NOP command is required. The exit procedure is faster than
in self-refresh mode.
When self-refresh mode is enabled, it is recommended to avoid enabling low-power mode.
When low-power mode is enabled, it is recommended to avoid enabling self-refresh mode.
This is described in
T
RCD
= 3
col a
CAS = 2
Figure 19-8
col b
Dna
col c
below.
Dnb
col d
Dnc
col e
Dnd
col f
Dne
Dnf
1768I–ATARM–09-Jul-09
Low Power Mode