AT91RM9200-QU-002 Atmel, AT91RM9200-QU-002 Datasheet - Page 688

IC ARM9 MCU 208 PQFP

AT91RM9200-QU-002

Manufacturer Part Number
AT91RM9200-QU-002
Description
IC ARM9 MCU 208 PQFP
Manufacturer
Atmel
Series
AT91SAMr

Specifications of AT91RM9200-QU-002

Core Processor
ARM9
Core Size
16/32-Bit
Speed
180MHz
Connectivity
EBI/EMI, Ethernet, I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals
POR
Number Of I /o
122
Program Memory Size
128KB (128K x 8)
Program Memory Type
ROM
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
208-MQFP, 208-PQFP
Processor Series
AT91Rx
Core
ARM7TDMI
Data Bus Width
32 bit
Data Ram Size
16 KB
Interface Type
2-Wire, EBI, I2S, SPI, UART, USART
Maximum Clock Frequency
180 MHz
Number Of Programmable I/os
122
Number Of Timers
10 bit
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
AT91SAM-ICE, AT91-ISP, AT91RM9200-EK
Minimum Operating Temperature
- 40 C
Eeprom Memory
0 Bytes
Input Output
122
Interface
EBI/EMI, UART/USART
Ios
122
Memory Type
ROM
Number Of Bits
32
Package Type
208-pin PQFP
Programmable Memory
128K Bytes
Timers
3-16-bit
Voltage, Range
1.65-1.95 V
Cpu Family
91R
Device Core
ARM920T
Device Core Size
32b
Frequency (max)
180MHz
Total Internal Ram Size
16KB
# I/os (max)
122
Number Of Timers - General Purpose
6
Operating Supply Voltage (typ)
1.8/3.3V
Operating Supply Voltage (max)
1.95/3.6V
Operating Supply Voltage (min)
1.65/3V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
208
For Use With
AT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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AT91RM9200
Version C Changes Since Last Issue (Continued)
Master Mode Operations: Cross reference to SPI User interface clarified. CSR 04-406
Table 69: SPI Bus Protocol Mode, NCPHA column corrected. CSR 04-239
Figure 170. TWI Write in Master Mode. “Set the control register”; reference to slave removed.
Figure 171. TWI Read in Master Mode. Set the control register”; reference to slave removed.
Changes to definitions of abbreviations in TWI “Transmitting Data” figure drawings.
TWI Master Mode Register. IADRSZ[9:8], change to first line.
TWI Internal Address Register. Text added to IADR description.
TWI Status Register. Change to TXCOMP bit. Reference to slave removed.
Multi-drop Mode: PAR field setting changed. CSR 04-187
Receive NACK Inhibit: “Moreover, if INACK is reset”......(replaces; if INACK is set) CSR 05-006
RS485 Mode and Figure 196. Typical Connection to an RS485 bus; changed RTS signal information. CSR 03-
190
Table 94. Bus Topology; footnote added to Type column of Pin Number “2” row.
Command/Response Operation: PWSEN bit power saving formula changed...dividing the MCI clock by
[(2
MCI_MR: PSWSDIV bit power saving formula changed... MCI clock divided by [(2
Power Saving Mode. CSR 05-009
UDP: Overview, text changed.
Main features of UDP changed. CSR 04-026
Figure 244. Board Schematic to Interface USB Device Peripheral. USB signals added to figure.
Figure 244: Resistor level changed. CSR 04-025, CSR 04-116
UDP User Interface: Transceiver Control Register (USB_TXVC) added.
Power Management: Steps to put EMAC in Local Loopback Mode added. CSR 05-014
Table 109: V
CSR 04-076
V
I
Power Consumption: added; • EMAC 50MHz clock not connected
Table 113: Power Consumption for PMC Modes, and Table 114: Power Consumption by Peripheral,
Consumption values changed. CSR 03-234
Table 114: Power Consumption by Peripheral. Note added to EMAC line
Table 117: Phase Lock Loop Characteristics, changes to “F
eliminated. CSR 04-234, CSR 04-006
Temperature Derating Factor: Figures 266, 267 and 268; derating curves changed. CSR 05-013
Package Drawings: Tables 136 - 141 added, figure 278; 256-ball BGA package drawing changed.
Soldering Profiles: Tables 142 - 143 added for Standard package and table 144 for Green and RoHS-
compliant package.
Table 145; Ordering Information. New information added.
SC
DDIOM
PWSDIV
Condition changed to On V
and V
)+1].
DDIOM
DDIOP
and V
DC Supply Characteristics, Min changed to 3.0
DDIOP
DC Supply Characteristics, Max changed to 3.6.
DDcore
= 1.95V
OUT
” line. The “K
0
“ and “I
PWSDIV
P
” lines have been
)+1] when entering
1768I–ATARM–09-Jul-09

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