AT91RM9200-QU-002 Atmel, AT91RM9200-QU-002 Datasheet - Page 665

• Manufacturer Part Number: AT91RM9200-QU-002
• Description: IC ARM9 MCU 208 PQFP
• Manufacturer: Atmel
• Series: AT91SAMr

Specifications of AT91RM9200-QU-002

• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 180MHz
• Connectivity: EBI/EMI, Ethernet, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: POR
• Number Of I /o: 122
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: ROM
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 1.95 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-MQFP, 208-PQFP
• Processor Series: AT91Rx
• Core: ARM7TDMI
• Data Bus Width: 32 bit
• Data Ram Size: 16 KB
• Interface Type: 2-Wire, EBI, I2S, SPI, UART, USART
• Maximum Clock Frequency: 180 MHz
• Number Of Programmable I/os: 122
• Number Of Timers: 10 bit
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: AT91SAM-ICE, AT91-ISP, AT91RM9200-EK
• Minimum Operating Temperature: - 40 C
• Eeprom Memory: 0 Bytes
• Input Output: 122
• Interface: EBI/EMI, UART/USART
• Ios: 122
• Memory Type: ROM
• Number Of Bits: 32
• Package Type: 208-pin PQFP
• Programmable Memory: 128K Bytes
• Timers: 3-16-bit
• Voltage, Range: 1.65-1.95 V
• Cpu Family: 91R
• Device Core: ARM920T
• Device Core Size: 32b
• Frequency (max): 180MHz
• Total Internal Ram Size: 16KB
• # I/os (max): 122
• Number Of Timers - General Purpose: 6
• Operating Supply Voltage (typ): 1.8/3.3V
• Operating Supply Voltage (max): 1.95/3.6V
• Operating Supply Voltage (min): 1.65/3V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 208
• For Use With: AT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

39.3
39.3.1
1768I–ATARM–09-Jul-09
Soldering Profiles
Standard Packages
Table 39-10
Table 39-10. Soldering Profile
Small packages may be subject to higher temperatures if they are reflowed in boards with larger
components. In this case, small packages may have to withstand temperatures of up to 235⋅ C,
not 220⋅ C (IR reflow).
Recommended package reflow conditions depend on package thickness and volume. See
Table
Table 39-11. Recommended Package Reflow Conditions (LQFP and BGA)
Notes:
A maximum of three reflow passes is allowed per component.
Average Ramp-up Rate (183⋅ C to Peak)
Preheat Temperature 125⋅ C ±25⋅ C
Temperature Maintained Above 183⋅ C
Time within 5⋅ C of Actual Peak Temperature
Peak Temperature Range
Ramp-down Rate
Time 25⋅ C to Peak Temperature
Parameter
Convection
VPR
IR/Convection
39-11.
1. The packages are qualified by Atmel by using IR reflow conditions, not convection or VPR.
2. By default, the package level 1 is qualified at 220⋅ C (unless 235⋅ C is stipulated).
3. The body temperature is the most important parameter but other profile parameters such as
total exposure time to hot temperature or heating rate may also influence component reliability.
gives the recommended soldering profile from J-STD-20.
Convection or
IR/Convection
3⋅ C/sec. max.
120 sec. max
60 sec. to 150 sec.
10 sec. to 20 sec.
220 +5/-0⋅ C or
235 +5/-0⋅ C
6⋅ C/sec.
6 min. max
Temperature
220 +5/-0⋅ C
215 to 219⋅ C
220 +5/-0⋅ C
VPR
10⋅ C/sec.
60 sec.
215 to 219⋅ C or
235 +5/-0⋅ C
10⋅ C/sec.
AT91RM9200
(1) (2)(3)
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