DF3048X16V Renesas Electronics America, DF3048X16V Datasheet - Page 605

• Manufacturer Part Number: DF3048X16V
• Description: MCU 5V 128K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3048X16V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 18 ROM
18.3.3
Reliability of Programmed Data
A highly effective way to improve data retention characteristics is to bake the programmed chips
at 150°C, then screen them for data errors. This procedure quickly eliminates chips with PROM
memory cells prone to early failure.
Figure 18.6 shows the recommended screening procedure.
Program chip and verify programmed data
Bake chip for 24 to 48 hours at
125 C to 150 C with power off
Read and check program
Install
Figure 18.6 Recommended Screening Procedure
If a series of programming errors occurs while the same PROM programmer is in use, stop
programming and check the PROM programmer and socket adapter for defects. Please inform
Renesas Technology of any abnormal conditions noted during or after programming or in
screening of program data after high-temperature baking.
Rev. 7.00 Sep 21, 2005 page 579 of 878
REJ09B0259-0700