HD6417750SF200V Renesas Electronics America, HD6417750SF200V Datasheet - Page 319

• Manufacturer Part Number: HD6417750SF200V
• Description: MPU 3V 16K PB-FREE 208-QFP
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7750r

Specifications of HD6417750SF200V

• Core Processor: SH-4
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, FIFO, SCI, SmartCard
• Peripherals: DMA, POR, WDT
• Number Of I /o: 28
• Program Memory Type: ROMless
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 2.07 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 208-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

1. 1-step operation: 1 issue cycle
2. Load/store: 1 issue cycle
3. GBR-based load/store: 1 issue cycle
4. JMP, RTS, BRAF: 2 issue cycles
5. TST.B: 3 issue cycles
6. AND.B, OR.B, XOR.B: 4 issue cycles
7. TAS.B: 5 issue cycles
8. RTE: 5 issue cycles
9. SLEEP: 4 issue cycles
EXT[SU].[BW], MOV, MOV#, MOVA, MOVT, SWAP.[BW], XTRCT, ADD*, CMP*,
DIV*, DT, NEG*, SUB*, AND, AND#, NOT, OR, OR#, TST, TST#, XOR, XOR#,
ROT*, SHA*, SHL*, BF*, BT*, BRA, NOP, CLRS, CLRT, SETS, SETT,
LDS to FPUL, STS from FPUL/FPSCR, FLDI0, FLDI1, FMOV, FLDS, FSTS,
single-/double-precision FABS/FNEG
MOV.[BWL]. FMOV*@, LDS.L to FPUL, LDTLB, PREF, STS.L from FPUL/FPSCR
MOV.[BWL]@(d,GBR)
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Figure 8.2 Instruction Execution Patterns
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Rev.7.00 Oct. 10, 2008 Page 233 of 1074
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Section 8 Pipelining
REJ09B0366-0700
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