HD6417750SF200V Renesas Electronics America, HD6417750SF200V Datasheet - Page 945

• Manufacturer Part Number: HD6417750SF200V
• Description: MPU 3V 16K PB-FREE 208-QFP
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7750r

Specifications of HD6417750SF200V

• Core Processor: SH-4
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, FIFO, SCI, SmartCard
• Peripherals: DMA, POR, WDT
• Number Of I /o: 28
• Program Memory Type: ROMless
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 2.07 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 208-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

20.2.6
BARB is the channel B break address register. The bit configuration is the same as for BARA.
20.2.7
BASRB is the channel B break ASID register. The bit configuration is the same as for BASRA.
20.2.8
BAMRB is the channel B break address mask register. The bit configuration is the same as for
BAMRA.
20.2.9
Legend:
Initial value:
Initial value:
Initial value:
Initial value:
Break Address Register B (BARB)
Break ASID Register B (BASRB)
Break Address Mask Register B (BAMRB)
Break Data Register B (BDRB)
*: Undefined
R/W:
R/W:
R/W:
R/W:
Bit:
Bit:
Bit:
Bit:
BDB31
BDB23
BDB15
BDB7
R/W
R/W
R/W
R/W
31
23
15
7
*
*
*
*
BDB30
BDB22
BDB14
BDB6
R/W
R/W
R/W
R/W
30
22
14
*
*
*
6
*
BDB29
BDB21
BDB13
BDB5
R/W
R/W
R/W
R/W
29
21
13
5
*
*
*
*
BDB28
BDB20
BDB12
BDB4
R/W
R/W
R/W
R/W
28
20
12
4
*
*
*
*
Rev.7.00 Oct. 10, 2008 Page 859 of 1074
Section 20 User Break Controller (UBC)
BDB27
BDB19
BDB11
BDB3
R/W
R/W
R/W
R/W
27
19
11
*
*
*
3
*
BDB26
BDB18
BDB10
BDB2
R/W
R/W
R/W
R/W
26
18
10
2
*
*
*
*
REJ09B0366-0700
BDB25
BDB17
BDB9
BDB1
R/W
R/W
R/W
R/W
25
17
9
1
*
*
*
*
BDB24
BDB16
BDB8
BDB0
R/W
R/W
R/W
R/W
24
16
*
*
8
*
0
*