LFXP2-17E-5FN484I Lattice, LFXP2-17E-5FN484I Datasheet - Page 197

• Manufacturer Part Number: LFXP2-17E-5FN484I
• Description: FPGA - Field Programmable Gate Array 17K LUTs 358 I/O Ins on DSP 1.2V -5 Spd
• Manufacturer: Lattice

Specifications of LFXP2-17E-5FN484I

• Number Of Macrocells: 17000
• Number Of Programmable I/os: 358
• Data Ram Size: 282624
• Supply Voltage (max): 1.26 V
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Supply Voltage (min): 1.14 V
• Package / Case: FPBGA-484
• Number Of Logic Elements/cells: *
• Number Of Labs/clbs: *
• Total Ram Bits: 282624
• Number Of I /o: 358
• Number Of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: *
• Operating Temperature: -40°C ~ 100°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Lattice Semiconductor
The SO pin stays in the HIGHZ state throughout this command.
Figure 10-54. Bit Shifting Order
When the data buffer has filled up to one page of data, driving the Chip Select pin to high terminates the data shift-
ing. After the Chip Select pin is driven from low to high, a minimum of three clocks are required to initiate the pro-
gramming action. In the programming action, the data buffer content is copied in parallel from the data buffer into
the TAG memory Flash cells. The status bit is set to 0 when the programming actions begin. The status bit is set to
1 when the programming action is done successfully.
Figure 10-55. Data Buffer to Flash Cell Mapping
When the programming action complete, the STATUS bit is set to 1. The exact same image is written into the Flash
cells of the TAG Memory block when the programming action complete.
Figure 10-56. PROGRAM_TAG Waveform
READ_TAG (4Eh)
The READ_TAG command enables the Flash programming engine to transfer data programmed in the Flash cells
to the data buffer. The transfer action starts on the third dummy clock after the 8-bit opcode. The delay time derived
from the 21 dummy clocks is the time required to transfer the Flash cells data into the data buffer. The transfer
action, once initiated, does not need the clock to continue to run. The clock count is only required to enable the SO
pin. If the Flash circuitry is not yet enabled, the device will need extra delay time to enable the Flash circuitry before
transfer can take place. This extra delay must be provided after the third dummy clock and before the 24th dummy
clock.
If the READ_TAG command is preceded by the WRITE _EN command, then it is fast read. The device does not
require extra delay to enable the Flash circuitry.
The 20 dummy clocks after the transfer is initiated to before enabling the SO pin are considered delay clocks.
SI
Cell N-1
Flash
CS
CLK
SI
SO
Bit N-1
Bit N-1
Three Clocks To Initiate The Program Action
Shifting Clocks
8 Command
Flash Memory Cells
Optional Extra Clocks
10-47
HIGH IMPEDANCE
LatticeXP2 Memory Usage Guide
Bit 0
Bit 0
Cell 0
Flash
SO