IDT88K8483 Integrated Device Technology, IDT88K8483 Datasheet - Page 148

• Manufacturer Part Number: IDT88K8483
• Description: Spi-4 Exchange Document Issue 1.0
• Manufacturer: Integrated Device Technology

Thermal Characteristics
IDT IDT88K8483
Reference for Termination
I/O Reference for LDVS
I/O Reference for HSTL
Maximum Power Dissipation total
Maximum Power Dissipation of core
Maximum Power Dissipation of each LVDS SPI-4
Interface I/O
Maximum Power Dissipation of HSTL I/O
(Memory Interface)
Power Dissipation of LVTTL I/O
Maximum Power Dissipation of Analog circuits
Thermal Resistance (Junction to case)
Thermal Resistance (Ambient)
Thermal Resistance (Junction to Board)
1.
Typical Power Dissipation for 2 SPI4 (LVDS) interfaces is 1.1W.
Typical Power Dissipation for 1SPI4 (LVDS) interface is 0.7W.
Typical Power Dissipation for 1 Memory (HSTL) interface is 0.4W.
Typical Power Dissipation for 0 Memory (HSTL) interface is 0.08W.
2.
Typical Power Dissipation for 3 SPI4 (LVDS) interfaces is 1.5W.
Test Conditions follows standard test methods and procedures for measuring thermal impedance, per EIA/JEDEC51. Test board: 4 layers (2s/2p) -
101.6mmx114.6mmx1.6mm.
Parameter
Parameter
3
V
V
V
TT
SPI4A/B/C_VREF
QDR_IMP
2
3
Table 165 Recommended Operating Conditions (Part 2 of 2)
Symbol
/V
G_IMP
Table 166 Thermal Characteristics
P
P
P
P
P
P
Θ
Θ
Θ
T
VDDC12
VDDL25
VDDH15/VDDH25
VDDT33
VDDA25
JC
JA
JB
V
V
V
Symbol
SS
SS
SS
=0
=0
=0
148 of 162
Conditions
Ta=25
Ta=25
Ta=25
Ta=25
Ta=25
Ta=25
Air flow 0.0 m/s
Air flow 1.0 m/s
Air flow 2.0 m/s
Air flow 3.0 m/s
Air flow 4.0 m/s
Air flow 5.0 m/s
°
°
°
°
°
°
C, F
C, F
C, F
C, F
C, F
C, F
MCLK
MCLK
MCLK
MCLK
MCLK
MCLK
Conditions
=200 MHz
=200 MHz
=200 MHz
=200 MHz
=200 MHz
=200 MHz
Min
1.14
0.68
0.7
V
V
DDH15
DDH15
Typ
1.2
/2
/2
Max
1.26
0.8
0.8
Value
12.6
2.85
0.3
8.7
7.2
6.5
5.8
6
0.33W
October 20, 2006
4.4W
0.5W
0.4W
0.5W
°
2W
°
°
°
°
°
C/W
°
°
C/W
C/W
C/W
C/W
C/W
C/W
C/W
1
Unit
V
V
V