DK86064-2 Fujitsu Semiconductor America Inc, DK86064-2 Datasheet - Page 3

• Manufacturer Part Number: DK86064-2
• Description: KIT DEB DUAL 14BIT DAC MB86064
• Manufacturer: Fujitsu Semiconductor America Inc

Specifications of DK86064-2

• Number Of Dac's: 2
• Number Of Bits: 14
• Outputs And Type: 1, Differential
• Sampling Rate (per Second): 1G
• Data Interface: Serial
• Dac Type: Current
• Voltage Supply Source: Analog and Digital
• Operating Temperature: -40°C ~ 85°C
• Utilized Ic / Part: MB86064
• For Use With: 865-1111 - DAC DK FPGA ADAPTER BOARD865-1012 - KIT DEV DUAL 14BIT MB86064 SMA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 865-1010

October 2005 Version 1.2
FME/MS/DAC80/DS/4972
MB86064 Dual 14-bit 1GSa/s DAC
6
7
Appendix A Default Register Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Copyright © 2004-2005 Fujitsu Microelectronics Europe GmbH
Disclaimer : The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before
5.4 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Application Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
6.1 PCB Power & Ground Plane Splits and Decoupling . . . . . . . . . . . . 40
6.2 Input Clock Interfacing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
6.3 Clock Duty Cycle Optimisation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
6.4 Analog Output Interfacing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
6.5 Example Setup Register Settings . . . . . . . . . . . . . . . . . . . . . . . . . . 46
6.6 Technical Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Development Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
7.1 Using DKUSB-1 in Target Applications . . . . . . . . . . . . . . . . . . . . . . 49
ordering.The information and circuit diagrams in this document are presented “as is”, no license is granted by implication or otherwise.
6.4.1
6.4.2
6.5.1
6.5.2
6.5.3
6.5.4
A.1
A.2
Transformer Coupled Output Circuit. . . . . . . . . . . . . . . . . . 44
Direct Interface to Quadrature Modulator . . . . . . . . . . . . . . 45
Dual DAC, LVDS data, Clock Outputs enabled . . . . . . . . . 46
Single DAC, LVDS data port A, driving DAC A . . . . . . . . . 46
Multiplexed LVDS data into DAC A (A=EVEN, B=ODD) . . 46
Waveform Memory Module, Different A & B Waveforms . . 46
DAC Core Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Waveform Memory Module Registers . . . . . . . . . . . . . . 51
This device contains circuitry to protect the inputs against damage due to high static voltages or electric fields.
However, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum
rated voltages to this high impedance circuit.
without detection. Ensure proper ESD procedures are followed when handling this
High electrostatic charges can accumulate in the human body and discharge
ELECTROSTATIC DISCHARGE SENSITIVE DEVICE
Production
CAUTION
device.
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