LPC2470FET208,551 NXP Semiconductors, LPC2470FET208,551 Datasheet - Page 175
LPC2470FET208,551
Manufacturer Part Number
LPC2470FET208,551
Description
IC ARM7 MCU LCD 208-TFBGA
Manufacturer
NXP Semiconductors
Series
LPC2400r
Datasheets
1.OM11077.pdf
(792 pages)
2.LPC2470FET208551.pdf
(89 pages)
3.LPC2470FET208551.pdf
(91 pages)
Specifications of LPC2470FET208,551
Package / Case
208-TFBGA
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
160
Program Memory Type
ROMless
Ram Size
98K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2C/I2S/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
160
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB2470U
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Package
208TFBGA
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
Operating Supply Voltage
3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4362
935284071551
LPC2470FET208-S
935284071551
LPC2470FET208-S
Available stocks
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Quantity
Price
Company:
Part Number:
LPC2470FET208,551
Manufacturer:
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Part Number:
LPC2470FET208,551
Manufacturer:
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[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10] Pad provides special analog functionality.
[11] Pad provides special analog functionality.
[12] Pad provides special analog functionality.
[13] Pad provides special analog functionality.
[14] Pad provides special analog functionality.
[15] Either the I
[16] Either the USB OTG function or the LCD function is selectable.
[17] Either the trace function or the LCD function is selectable.
[18] Either one of the external interrupts EINT1 to EINT3 or the LCD function is selectable.
[19] Either one of the timer outputs MAT2[1] and MAT2[0] or the LCD function is selectable.
6. LPC2420/60/70 boot control
UM10237_4
User manual
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis.
5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a ADC input,
digital section of the pad is disabled.
5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output,
digital section of the pad is disabled.
Open-drain 5 V tolerant digital I/O pad, compatible with I
functionality. When power is switched off, this pin connected to the I
configuration applies to all functions on this pin.
Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and
Low-speed mode only).
5 V tolerant pad with 5 ns glitch filter providing digital I/O functions with TTL levels and hysteresis.
5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis.
Pad provides special analog functionality.
Pad provides special analog functionality.
2
S function or the LCD function is selectable.
The flashless LPC2420, LPC2460, and LPC2470 use pins P3[15]/D15 and P3[14]/D14 for
configuring the external memory bus during the boot process. These pins are sampled
during Power-on Reset (POR). See
pins.
Table 125. Boot control on pins P3[15]/D15 and P3/14]/D14
During the boot process, external memory banks 0 and 1 are configured with the same
data bus width determined by the setting of the two boot pins P3[15]/D15 and P3[14]/D14.
Unused address pins (A0 when booting from 16-bit wide external memory, A1 and A0
when booting from 32-bit wide memory) are configured as GPIO.
The boot loader remaps the vector table to external memory (see
0x3) and branches to address 0x0. The external boot memory must be connected to chip
select 1 (CS1). Note that CS1 is mirrored onto CS0 because the address mirror bit is set
P3[15]/D15
BOOT1
0
0
1
1
P3[14]/D14 Description
BOOT0
0
1
0
1
Rev. 04 — 26 August 2009
Boot from 8-bit external memory on CS1. Sampled on POR signal.
Reserved. Do not use.
Boot from 32-bit external memory on CS1. Sampled on POR signal.
Boot from 16-bit external memory on CS1. Sampled on POR signal.
2
C-bus 400 kHz specification. It requires an external pull-up to provide output
2
Table 8–125
C-bus is floating and does not disturb the I
Chapter 8: LPC24XX Pin configuration
for possible settings of the boot control
Table
UM10237
2
© NXP B.V. 2009. All rights reserved.
C lines. Open-drain
2–21, MEMAP =
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