LPC2470FET208,551 NXP Semiconductors, LPC2470FET208,551 Datasheet - Page 698
LPC2470FET208,551
Manufacturer Part Number
LPC2470FET208,551
Description
IC ARM7 MCU LCD 208-TFBGA
Manufacturer
NXP Semiconductors
Series
LPC2400r
Datasheets
1.OM11077.pdf
(792 pages)
2.LPC2470FET208551.pdf
(89 pages)
3.LPC2470FET208551.pdf
(91 pages)
Specifications of LPC2470FET208,551
Package / Case
208-TFBGA
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
160
Program Memory Type
ROMless
Ram Size
98K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2C/I2S/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
160
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, MCB2470U
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Package
208TFBGA
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
Operating Supply Voltage
3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4362
935284071551
LPC2470FET208-S
935284071551
LPC2470FET208-S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2470FET208,551
Manufacturer:
Exar
Quantity:
92
Company:
Part Number:
LPC2470FET208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
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UM10237_4
User manual
4.1 Memory map after any reset
4.2 Communication protocol
Pin P2.10 that is used as hardware request for ISP requires special attention. Since P2.10
is in high impedance mode after reset, it is important that the user provides external
hardware (a pull-up resistor or other device) to put the pin in a defined state. Otherwise
unintended entry into ISP mode may occur.
When ISP mode is entered after a power on reset, the IRC and PLL are used to generate
CCLK of 14.748 MHz.
The boot loader resides in an on-chip ROM sector of 8 kB in size. After any reset the
entire boot sector is also mapped to the top of the on-chip memory space i.e. the boot
block is also visible in the memory region starting from the address 0x7FFF E000. The
serial boot loader is designed to run from this memory area, and both the ISP and IAP
software use parts of the on-chip RAM. The RAM usage is described later in this chapter.
In addition, the bottom 64 byte of the ROM boot sector are also visible in the memory
region starting from address 0x0000 0000, i.e. the interrupt vectors are mapped to the
boot ROM sector. The reset vector contains a jump instruction to the entry point of the
serial boot loader software.
All ISP commands should be sent as single ASCII strings. Strings should be terminated
with Carriage Return (CR) and/or Line Feed (LF) control characters. Extra <CR> and
<LF> characters are ignored. All ISP responses are sent as <CR><LF> terminated ASCII
strings. Data is sent and received in UU-encoded format.
Fig 141. Map of lower memory after reset for flashless LPC2400 parts
2.0 GB - 8 kB
0.0 GB
2.0 GB
Rev. 04 — 26 August 2009
Chapter 31: LPC24XX On-chip bootloader for flashless parts
(BOOT BLOCK INTERRUPT VECTORS)
ACTIVE INTERRUPT VECTORS
FROM THE BOOT BLOCK
8 kB BOOT BLOCK
UM10237
0x7FFF FFFF
0x7FFF E000
0x0000 0000
© NXP B.V. 2009. All rights reserved.
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