DF2378BVFQ35V Renesas Electronics America, DF2378BVFQ35V Datasheet - Page 1147

IC H8S/2378 MCU FLASH 144-LQFP

DF2378BVFQ35V

Manufacturer Part Number
DF2378BVFQ35V
Description
IC H8S/2378 MCU FLASH 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2378BVFQ35V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
35MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
97
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 6x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
For Use With
YLCDRSK2378 - KIT DEV EVAL H8S/2378 LCDYR0K42378FC000BA - KIT EVAL FOR H8S/2378HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)EDK2378 - DEV EVAL KIT FOR H8S/2378
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2378BVFQ35V
Manufacturer:
Renesas Electronics America
Quantity:
135
Part Number:
DF2378BVFQ35V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Read
Write
EDACK2, EDACK3
Note:
DACK0, DACK1
φ
A23 to A0
RAS5 to RAS2
UCAS
LCAS
OE, RD
HWR
D15 to D0
OE, RD
HWR
D15 to D0
AS
DACK and EDACK timing: when DDS = 0 and EDDS = 0
RAS timing: when RAST = 0
Figure 26.16 DRAM Access Timing: Two-State Burst Access
Tp
Tr
Tc1
t
t
Rev.7.00 Mar. 18, 2009 page 1079 of 1136
DACD1
EDACD1
Tc2
Section 26 Electrical Characteristics
t
t
RCH
RCS1
t
t
DACD2
EDACD2
Tc1
t
CPW1
t
AC3
REJ09B0109-0700
Tc2

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