HD6417750RF200DV Renesas Electronics America, HD6417750RF200DV Datasheet - Page 1066

• Manufacturer Part Number: HD6417750RF200DV
• Description: MPU 1.5/3.3V 0K I-TEMP PB-FREE 2
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7750r

Specifications of HD6417750RF200DV

• Core Processor: SH-4
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, FIFO, SCI, SmartCard
• Peripherals: DMA, POR, WDT
• Number Of I /o: 28
• Program Memory Type: ROMless
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.35 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-QFP Exposed Pad, 208-eQFP, 208-HQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

Section 22 Electrical Characteristics
Rev.7.00 Oct. 10, 2008 Page 980 of 1074
REJ09B0366-0700
DACKn
(SA: IO ← memory)
Legend:
IO: DACK device
SA: Single address DMA transfer
DA: Dual address DMA transfer
DACK set to active-high
CKIO
CSn
RD/WR
RAS
CASn
BS
A25–A0
D63–D0
(read)
D63–D0
(write)
(EDO Mode, RCD[1:0] = 00, AnW[2:0] = 000, TPC[2:0] = 001)
Figure 22.38 DRAM Bus Cycle
t
t
T1r
t
t
t
t
t
AD
RASD
CSD
RWD
DACD
CASD1
WDD
Row
t
Tr2
t
DACD
RASD
t
t
t
CASD1
Tc1
BSD
AD
t
Column
Tc2
BSD
t
RDS
Tce
t
Tpc
t
t
t
t
CASD1
RWD
AD
CSD
RASD
t
RDH