HD6417750RF200DV Renesas Electronics America, HD6417750RF200DV Datasheet - Page 688

• Manufacturer Part Number: HD6417750RF200DV
• Description: MPU 1.5/3.3V 0K I-TEMP PB-FREE 2
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7750r

Specifications of HD6417750RF200DV

• Core Processor: SH-4
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, FIFO, SCI, SmartCard
• Peripherals: DMA, POR, WDT
• Number Of I /o: 28
• Program Memory Type: ROMless
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.35 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-QFP Exposed Pad, 208-eQFP, 208-HQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

Section 14 Direct Memory Access Controller (DMAC)
14.4
14.4.1
Examples of transfer of data in external memory to an external device with DACK using DMAC
channel 1 are considered here.
Table 14.10 shows the transfer conditions and the corresponding register settings.
Table 14.10 Conditions for Transfer between External Memory and an External Device
Transfer Conditions
Transfer source: external memory
Transfer source: external device with DACK
Number of transfers: 32
Transfer source address: decremented
Transfer destination address: (setting invalid)
Transfer request source: external pin (DREQ1)
edge detection
Bus mode: burst
Transfer unit: word
No interrupt request at end of transfer
Channel priority order: 2 > 0 > 1 > 3
Rev.7.00 Oct. 10, 2008 Page 602 of 1074
REJ09B0366-0700
Examples of Use
Examples of Transfer between External Memory and an External Device with
DACK
with DACK, and Corresponding Register Settings
Register
SAR1
DAR1
DMATCR1
CHCR1
DMAOR
Set Value
H'0C000000
(Accessed by DACK)
H'00000020
H'000022A5
H'00000201