HD6417750RF200DV Renesas Electronics America, HD6417750RF200DV Datasheet - Page 324

• Manufacturer Part Number: HD6417750RF200DV
• Description: MPU 1.5/3.3V 0K I-TEMP PB-FREE 2
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7750r

Specifications of HD6417750RF200DV

• Core Processor: SH-4
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, FIFO, SCI, SmartCard
• Peripherals: DMA, POR, WDT
• Number Of I /o: 28
• Program Memory Type: ROMless
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.35 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-QFP Exposed Pad, 208-eQFP, 208-HQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

Section 8 Pipelining
8.2
Instructions are categorized into six groups according to the internal function blocks used, as
shown in table 8.1. Table 8.2 shows the parallel-executability of pairs of instructions in terms of
groups. For example, ADD in the EX group and BRA in the BR group can be executed in parallel.
Table 8.1
Rev.7.00 Oct. 10, 2008 Page 238 of 1074
REJ09B0366-0700
1. MT Group
CLRT
CMP/EQ
CMP/EQ
CMP/GE
CMP/GT
2. EX Group
ADD
ADD
ADDC
ADDV
AND
AND
DIV0S
DIV0U
DIV1
DT
EXTS.B
EXTS.W
EXTU.B
EXTU.W
MOV
MOVA
Parallel-Executability
Instruction Groups
#imm,R0
Rm,Rn
Rm,Rn
Rm,Rn
#imm,Rn
Rm,Rn
Rm,Rn
Rm,Rn
#imm,R0
Rm,Rn
Rm,Rn
Rm,Rn
Rn
Rm,Rn
Rm,Rn
Rm,Rn
Rm,Rn
#imm,Rn
@(disp,PC),R0 SHLL16
CMP/HI
CMP/HS
CMP/PL
CMP/PZ
CMP/STR
MOVT
NEG
NEGC
NOT
OR
OR
ROTCL
ROTCR
ROTL
ROTR
SHAD
SHAL
SHAR
SHLD
SHLL
Rm,Rn
Rm,Rn
Rn
Rn
Rm,Rn
Rn
Rm,Rn
Rm,Rn
Rm,Rn
#imm,R0
Rm,Rn
Rn
Rn
Rn
Rn
Rm,Rn
Rn
Rn
Rm,Rn
Rn
Rn
MOV
NOP
SETT
TST
TST
SHLL2
SHLL8
SHLR
SHLR16
SHLR2
SHLR8
SUB
SUBC
SUBV
SWAP.B
SWAP.W
XOR
XOR
XTRCT
Rm,Rn
#imm,R0
Rm,Rn
Rn
Rn
Rn
Rn
Rn
Rn
Rm,Rn
Rm,Rn
Rm,Rn
Rm,Rn
Rm,Rn
#imm,R0
Rm,Rn
Rm,Rn