HD6417750RF200DV Renesas Electronics America, HD6417750RF200DV Datasheet - Page 662

• Manufacturer Part Number: HD6417750RF200DV
• Description: MPU 1.5/3.3V 0K I-TEMP PB-FREE 2
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7750r

Specifications of HD6417750RF200DV

• Core Processor: SH-4
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, FIFO, SCI, SmartCard
• Peripherals: DMA, POR, WDT
• Number Of I /o: 28
• Program Memory Type: ROMless
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.35 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-QFP Exposed Pad, 208-eQFP, 208-HQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

Section 14 Direct Memory Access Controller (DMAC)
14.3.4
The DMAC supports the transfers shown in table 14.6. It can operate in single address mode, in
which either the transfer source or the transfer destination is accessed using the acknowledge
signal, or in dual address mode, in which both the transfer source and transfer destination
addresses are output. The actual transfer operation timing depends on the bus mode, which can be
either burst mode or cycle steal mode.
Table 14.6 Supported DMA Transfers
Transfer Source
External device
with DACK
External memory
Memory-mapped
external device
On-chip peripheral
module
Rev.7.00 Oct. 10, 2008 Page 576 of 1074
REJ09B0366-0700
Types of DMA Transfer
External Device
with DACK
Not available
Single address
mode
Single address
mode
Not available
External
Memory
Single address
mode
Dual address
mode
Dual address
mode
Dual address
mode
Transfer Destination
Memory-Mapped
External Device
Single address
mode
Dual address mode Dual address mode
Dual address mode Dual address mode
Dual address mode Not available
On-Chip
Peripheral Module
Not available