ep1s25 Altera Corporation, ep1s25 Datasheet - Page 143
ep1s25
Manufacturer Part Number
ep1s25
Description
Stratix Device Family Data Sheet
Manufacturer
Altera Corporation
Datasheet
1.EP1S25.pdf
(276 pages)
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Altera Corporation
July 2005
Notes to
(1)
(2)
(3)
R
Table 2–35. Differential On-Chip Termination
Symbol
D
(2)
Data measured over minimum conditions (T
V
Data measured over minimum conditions (T
V
LVDS data rate is supported for 840 Mbps using internal differential termination.
C C I O
CCIO
Table
= –5%).
= –5%).
Internal differential termination for LVDS
2–35:
Description
However, there is additional resistance present between the device ball
and the input of the receiver buffer, as shown in
resistance is because of package trace resistance (which can be calculated
as the resistance from the package ball to the pad) and the parasitic layout
metal routing resistance (which is shown between the pad and the
intersection of the on-chip termination and input buffer).
Figure 2–72. Differential Resistance of LVDS Differential Pin Pair (R
Table 2–35
commercial devices.
MultiVolt I/O Interface
The Stratix architecture supports the MultiVolt I/O interface feature,
which allows Stratix devices in all packages to interface with systems of
different supply voltages.
The Stratix VCCINT pins must always be connected to a 1.5-V power
supply. With a 1.5-V V
3.3-V tolerant. The VCCIO pins can be connected to either a 1.5-V, 1.8-V,
2.5-V, or 3.3-V power supply, depending on the output requirements.
defines the specification for internal termination resistance for
Package Ball
R
D
j
j
= –40 C, V
= 0 C, V
0.3 Ω
0.3 Ω
CCINT
C C I O
CCIO
Pad
Commercial (1),
Industrial (2),
+5%) and maximum conditions (T
+5%) and maximum conditions (T
level, input pins are 1.5-V, 1.8-V, 2.5-V, and
9.3 Ω
9.3 Ω
Conditions
(3)
Stratix Device Handbook, Volume 1
(3)
Input Buffer
LVDS
Differential On-Chip
Termination Resistor
Figure
Min
110
100
Resistance
Stratix Architecture
2–72. This
j
135
135
Typ
= 85 C,
j
= 100 C,
Max
165
170
D
)
2–129
Unit
W
W