MC9S08QG8CDTE Freescale Semiconductor, MC9S08QG8CDTE Datasheet - Page 153

• Manufacturer Part Number: MC9S08QG8CDTE
• Description: IC MCU 8K FLASH 10MHZ 16-TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QG8CDTE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 12
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-TSSOP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 20MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 512Byte
• # I/os (max): 12
• Number Of Timers - General Purpose: 1
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 16
• Package Type: TSSOP
• Processor Series: S08QG
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 1
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08QG8E
• Minimum Operating Temperature: - 40 C
• Package: 16TSSOP
• Family Name: HCS08
• Maximum Speed: 20 MHz
• For Use With: DEMO9S08QG8E - BOARD DEMO FOR MC9S08QG8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

10.4.1.2
The FLL engaged external (FEE) mode is entered when all the following conditions occur:
In FLL engaged external mode, the ICSOUT clock is derived from the FLL clock which is controlled by
the external reference clock.The FLL loop will lock the frequency to 512 times the filter frequency, as
selected by the RDIV bits. The ICSLCLK is available for BDC communications, and the external
reference clock is enabled.
10.4.1.3
The FLL bypassed internal (FBI) mode is entered when all the following conditions occur:
In FLL bypassed internal mode, the ICSOUT clock is derived from the internal reference clock. The FLL
clock is controlled by the internal reference clock, and the FLL loop will lock the FLL frequency to 512
times the filter frequency, as selected by the RDIV bits. The ICSLCLK will be available for BDC
communications, and the internal reference clock is enabled.
10.4.1.4
The FLL bypassed internal low power (FBILP) mode is entered when all the following conditions occur:
In FLL bypassed internal low power mode, the ICSOUT clock is derived from the internal reference clock
and the FLL is disabled. The ICSLCLK will be not be available for BDC communications, and the internal
reference clock is enabled.
10.4.1.5
The FLL bypassed external (FBE) mode is entered when all the following conditions occur:
In FLL bypassed external mode, the ICSOUT clock is derived from the external reference clock. The FLL
clock is controlled by the external reference clock, and the FLL loop will lock the FLL frequency to 512
Freescale Semiconductor
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CLKS bits are written to 00
IREFS bit is written to 0
RDIV bits are written to divide reference clock to be within the range of 31.25 kHz to 39.0625 kHz
CLKS bits are written to 01
IREFS bit is written to 1
BDM mode is active or LP bit is written to 0
CLKS bits are written to 01
IREFS bit is written to 1.
BDM mode is not active and LP bit is written to 1
CLKS bits are written to 10.
IREFS bit is written to 0.
BDM mode is active or LP bit is written to 0.
FLL Engaged External (FEE)
FLL Bypassed Internal (FBI)
FLL Bypassed Internal Low Power (FBILP)
FLL Bypassed External (FBE)
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 5
Internal Clock Source (S08ICSV1)
151