MC9S08QG8CDTE Freescale Semiconductor, MC9S08QG8CDTE Datasheet - Page 60

• Manufacturer Part Number: MC9S08QG8CDTE
• Description: IC MCU 8K FLASH 10MHZ 16-TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QG8CDTE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 12
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-TSSOP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 20MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 512Byte
• # I/os (max): 12
• Number Of Timers - General Purpose: 1
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 16
• Package Type: TSSOP
• Processor Series: S08QG
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 1
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08QG8E
• Minimum Operating Temperature: - 40 C
• Package: 16TSSOP
• Family Name: HCS08
• Maximum Speed: 20 MHz
• For Use With: DEMO9S08QG8E - BOARD DEMO FOR MC9S08QG8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Chapter 4 Memory Map and Register Definition
4.7.6
Only five command codes are recognized in normal user modes as shown in
Section 4.5.3, “Program and Erase Command
programming and erase operations.
All other command codes are illegal and generate an access error.
It is not necessary to perform a blank check command after a mass erase operation. The blank check
command is only required as part of the security unlocking mechanism.
58
FACCERR
FBLANK
Reset
Field
4
2
W
R
FLASH Command Register (FCMD)
Access Error Flag — FACCERR is set automatically when the proper command sequence is not obeyed exactly
(the erroneous command is ignored), if a program or erase operation is attempted before the FCDIV register has
been initialized, or if the MCU enters stop while a command was in progress. For a more detailed discussion of
the exact actions that are considered access errors, see
writing a 1 to FACCERR. Writing a 0 to FACCERR has no meaning or effect.
0 No access error.
1 An access error has occurred.
FLASH Verified as All Blank (erased) Flag — FBLANK is set automatically at the conclusion of a blank check
command if the entire FLASH array was verified to be erased. FBLANK is cleared by clearing FCBEF to write a
new valid command. Writing to FBLANK has no meaning or effect.
0 After a blank check command is completed and FCCF = 1, FBLANK = 0 indicates the FLASH array is not
1 After a blank check command is completed and FCCF = 1, FBLANK = 1 indicates the FLASH array is
0
0
7
completely erased.
completely erased (all 0xFF).
Page erase (512 bytes/page)
Byte program — burst mode
Table 4-12. FSTAT Register Field Descriptions (continued)
Mass erase (all FLASH)
0
0
6
Figure 4-10. FLASH Command Register (FCMD)
Byte program
Blank check
Command
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 5
Table 4-13. FLASH Commands
0
0
5
Execution,” for a detailed discussion of FLASH
0
0
4
FCMD
Description
0x05
0x20
0x25
0x40
0x41
FCMD
Section 4.5.5, “Access
3
0
0
Equate File Label
mPageErase
mMassErase
mBurstProg
mByteProg
mBlank
0
0
2
Table
Errors.” FACCERR is cleared by
4-13. Refer to
Freescale Semiconductor
0
0
1
0
0
0