MC9S08QG8CDTE Freescale Semiconductor, MC9S08QG8CDTE Datasheet - Page 262

• Manufacturer Part Number: MC9S08QG8CDTE
• Description: IC MCU 8K FLASH 10MHZ 16-TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QG8CDTE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 12
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-TSSOP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 20MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 512Byte
• # I/os (max): 12
• Number Of Timers - General Purpose: 1
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 16
• Package Type: TSSOP
• Processor Series: S08QG
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 1
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08QG8E
• Minimum Operating Temperature: - 40 C
• Package: 16TSSOP
• Family Name: HCS08
• Maximum Speed: 20 MHz
• For Use With: DEMO9S08QG8E - BOARD DEMO FOR MC9S08QG8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Development Support
17.4.3.5
This register provides read-only access to the high-order eight bits of the FIFO. Writes to this register have
no meaning or effect. In the event-only trigger modes, the FIFO only stores data into the low-order byte
of each FIFO word, so this register is not used and will read 0x00.
Reading DBGFH does not cause the FIFO to shift to the next word. When reading 16-bit words out of the
FIFO, read DBGFH before reading DBGFL because reading DBGFL causes the FIFO to advance to the
next word of information.
17.4.3.6
This register provides read-only access to the low-order eight bits of the FIFO. Writes to this register have
no meaning or effect.
Reading DBGFL causes the FIFO to shift to the next available word of information. When the debug
module is operating in event-only modes, only 8-bit data is stored into the FIFO (high-order half of each
FIFO word is unused). When reading 8-bit words out of the FIFO, simply read DBGFL repeatedly to get
successive bytes of data from the FIFO. It isn’t necessary to read DBGFH in this case.
Do not attempt to read data from the FIFO while it is still armed (after arming but before the FIFO is filled
or ARMF is cleared) because the FIFO is prevented from advancing during reads of DBGFL. This can
interfere with normal sequencing of reads from the FIFO.
Reading DBGFL while the debugger is not armed causes the address of the most-recently fetched opcode
to be stored to the last location in the FIFO. By reading DBGFH then DBGFL periodically, external host
software can develop a profile of program execution. After eight reads from the FIFO, the ninth read will
return the information that was stored as a result of the first read. To use the profiling feature, read the FIFO
eight times without using the data to prime the sequence and then begin using the data to get a delayed
picture of what addresses were being executed. The information stored into the FIFO on reads of DBGFL
(while the FIFO is not armed) is the address of the most-recently fetched opcode.
260
Debug FIFO High Register (DBGFH)
Debug FIFO Low Register (DBGFL)
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 5
Freescale Semiconductor