MC9S08QG8CDTE Freescale Semiconductor, MC9S08QG8CDTE Datasheet - Page 55

IC MCU 8K FLASH 10MHZ 16-TSSOP

MC9S08QG8CDTE

Manufacturer Part Number
MC9S08QG8CDTE
Description
IC MCU 8K FLASH 10MHZ 16-TSSOP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08QG8CDTE

Core Processor
HCS08
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
12
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
16-TSSOP
Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
20MHz
Interface Type
I2C/SCI/SPI
Total Internal Ram Size
512Byte
# I/os (max)
12
Number Of Timers - General Purpose
1
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
16
Package Type
TSSOP
Processor Series
S08QG
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
512 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
1
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08QG8E
Minimum Operating Temperature
- 40 C
Package
16TSSOP
Family Name
HCS08
Maximum Speed
20 MHz
For Use With
DEMO9S08QG8E - BOARD DEMO FOR MC9S08QG8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S08QG8CDTE
Manufacturer:
ABB
Quantity:
101
Part Number:
MC9S08QG8CDTE
Manufacturer:
Freescale Semiconductor
Quantity:
41 991
Part Number:
MC9S08QG8CDTE
Manufacturer:
FREESCALE
Quantity:
500
Part Number:
MC9S08QG8CDTE
Manufacturer:
FREESCALE
Quantity:
500
Part Number:
MC9S08QG8CDTE
Manufacturer:
FREESCALE
Quantity:
20 000
Part Number:
MC9S08QG8CDTER
0
the MCU secure. During development, whenever the FLASH is erased, it is good practice to immediately
program the SEC00 bit to 0 in NVOPT so SEC01:SEC00 = 1:0. This would allow the MCU to remain
unsecured after a subsequent reset.
The on-chip debug module cannot be enabled while the MCU is secure. The separate background debug
controller can still be used for background memory access commands, but the MCU cannot enter active
background mode except by holding BKGD/MS low at the rising edge of reset.
A user can choose to allow or disallow a security unlocking mechanism through an 8-byte backdoor
security key. If the nonvolatile KEYEN bit in NVOPT/FOPT is 0, the backdoor key is disabled and there
is no way to disengage security without completely erasing all FLASH locations. If KEYEN is 1, a secure
user program can temporarily disengage security by:
The security key can be written only from secure memory (either RAM or FLASH), so it cannot be entered
through background commands without the cooperation of a secure user program.
The backdoor comparison key (NVBACKKEY through NVBACKKEY+7) is located in FLASH memory
locations in the nonvolatile register space so users can program these locations exactly as they would
program any other FLASH memory location. The nonvolatile registers are in the same 512-byte block of
FLASH as the reset and interrupt vectors, so block protecting that space also block protects the backdoor
comparison key. Block protects cannot be changed from user application programs, so if the vector space
is block protected, the backdoor security key mechanism cannot permanently change the block protect,
security settings, or the backdoor key.
Security can always be disengaged through the background debug interface by taking these steps:
Freescale Semiconductor
1. Writing 1 to KEYACC in the FCNFG register. This makes the FLASH module interpret writes to
2. Writing the user-entered key values to the NVBACKKEY through NVBACKKEY+7 locations.
3. Writing 0 to KEYACC in the FCNFG register. If the 8-byte key that was just written matches the
1. Disable any block protections by writing FPROT. FPROT can be written only with background
2. Mass erase FLASH if necessary.
3. Blank check FLASH. Provided FLASH is completely erased, security is disengaged until the next
the backdoor comparison key locations (NVBACKKEY through NVBACKKEY+7) as values to
be compared against the key rather than as the first step in a FLASH program or erase command.
These writes must be done in order starting with the value for NVBACKKEY and ending with
NVBACKKEY+7. STHX should not be used for these writes because these writes cannot be done
on adjacent bus cycles. User software normally would get the key codes from outside the MCU
system through a communication interface such as a serial I/O.
key stored in the FLASH locations, SEC01:SEC00 are automatically changed to 1:0 and security
will be disengaged until the next reset.
debug commands, not from application software.
reset.
To avoid returning to secure mode after the next reset, program NVOPT so SEC01:SEC00 = 1:0.
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 5
Chapter 4 Memory Map and Register Definition
53

Related parts for MC9S08QG8CDTE