MC9S08QG8CDTE Freescale Semiconductor, MC9S08QG8CDTE Datasheet - Page 28

• Manufacturer Part Number: MC9S08QG8CDTE
• Description: IC MCU 8K FLASH 10MHZ 16-TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QG8CDTE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 12
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-TSSOP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 20MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 512Byte
• # I/os (max): 12
• Number Of Timers - General Purpose: 1
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 16
• Package Type: TSSOP
• Processor Series: S08QG
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 1
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08QG8E
• Minimum Operating Temperature: - 40 C
• Package: 16TSSOP
• Family Name: HCS08
• Maximum Speed: 20 MHz
• For Use With: DEMO9S08QG8E - BOARD DEMO FOR MC9S08QG8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Chapter 2 External Signal Description
2.2.1
V
I/O buffer circuitry, ACMP and ADC modules, and to an internal voltage regulator. The internal voltage
regulator provides a regulated lower-voltage source to the CPU and other internal circuitry of the MCU.
Typically, application systems have two separate capacitors across the power pins: a bulk electrolytic
capacitor, such as a 10-μF tantalum capacitor, to provide bulk charge storage for the overall system, and a
bypass capacitor, such as a 0.1-μF ceramic capacitor, located as near to the MCU power pins as practical
to suppress high-frequency noise.
26
ASYNCHRONOUS
DD
INTERRUPT
V
INPUT
DD
and V
C1
NOTES:
SYSTEM
POWER
BACKGROUND HEADER
NOTE 1
1. Not required if using the internal clock option.
2. XTAL is the same pin as PTB6; EXTAL the same pin as PTB7.
3. The RESET pin can only be used to reset into user mode; you can not enter BDM using the RESET pin.
4. IRQ feature has optional internal pullup device.
5. RC filter on RESET/IRQ pin recommended for noisy environments.
SS
Power
BDM can be entered by holding MS low during POR or writing a 1 to BDFR in SBDFR with MS low after
issuing the BDM command.
+
3 V
X1
are the primary power supply pins for the MCU. This voltage source supplies power to all
OPTIONAL
R
MANUAL
C
RESET
10 μF
F
BLK
C2
V
+
DD
V
DD
R
4.7 kΩ–10 kΩ
S
0.1 μF
0.1 μF
C
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 5
BY
Figure 2-4. Basic System Connections
V
V
XTAL
NOTE 2
NOTE 2
DD
SS
EXTAL
BKGD
RESET/IRQ
MC9S08QG8/4
PORT
PORT
B
A
PTB4/MISO
PTB6/SDA/XTAL
PTB2/KBIP6/SPSCK/ADP6
PTB5/TPMCH1/SS
PTB7/SCL/EXTAL
PTA0/KBIP0/TPMCH0/ADP0/ACMP+
PTA1/KBIP1/ADP1/ACMP–
PTA2/KBIP2/SDA/ADP2
PTA3/KBIP3/SCL/ADP3
PTA4/ACMPO/BKGD/MS
PTA5/IRQ/TCLK/RESET
PTB0/KBIP4/RxD/ADP4
PTB1/KBIP5/TxD/ADP5
PTB3/KBIP7/MOSI/ADP7
Freescale Semiconductor
INTERFACE TO
APPLICATION
PERIPHERAL
SYSTEM
I/O AND