MC9S08QG8CDTE Freescale Semiconductor, MC9S08QG8CDTE Datasheet - Page 268

• Manufacturer Part Number: MC9S08QG8CDTE
• Description: IC MCU 8K FLASH 10MHZ 16-TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QG8CDTE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 12
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-TSSOP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 20MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 512Byte
• # I/os (max): 12
• Number Of Timers - General Purpose: 1
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 16
• Package Type: TSSOP
• Processor Series: S08QG
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 1
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08QG8E
• Minimum Operating Temperature: - 40 C
• Package: 16TSSOP
• Family Name: HCS08
• Maximum Speed: 20 MHz
• For Use With: DEMO9S08QG8E - BOARD DEMO FOR MC9S08QG8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Appendix A Electrical Characteristics
A.3
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits, and it is user-determined rather than being controlled by the
MCU design. To take P
voltage and V
pin current (heavy loads), the difference between pin voltage and V
The average chip-junction temperature (T
where:
266
T
θ
P
JA
D
A
= Ambient temperature, °C
= P
= Package thermal resistance, junction-to-ambient, °C/W
Thermal Characteristics
int
SS
+ P
Operating temperature range (packaged)
Thermal resistance
Thermal resistance
or V
I/O
Single-layer board
Four-layer board
DD
I/O
and multiply by the pin current for each I/O pin. Except in cases of unusually high
8-pin PDIP
8-pin NB SOIC
8-pin DFN
16-pin PDIP
16-pin TSSOP
16-pin QFN
24-pin QFN
8-pin PDIP
8-pin NB SOIC
8-pin DFN
16-pin PDIP
16-pin TSSOP
16-pin QFN
24-pin QFN
into account in power calculations, determine the difference between actual pin
Rating
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 5
Table A-2. Thermal Characteristics
T
J
= T
J
) in °C can be obtained from:
A
+ (P
M
C
D
× θ
Symbol
JA
θ
θ
)
T
JA
JA
A
SS
–40 to 125
–40 to 85
T
or V
Value
L
113
179
133
132
125
150
78
72
87
41
53
86
36
44
to T
DD
H
will be very small.
Freescale Semiconductor
°C/W
°C/W
Unit
°C
Eqn. A-1