MC9S08QG8CDTE Freescale Semiconductor, MC9S08QG8CDTE Datasheet - Page 21

• Manufacturer Part Number: MC9S08QG8CDTE
• Description: IC MCU 8K FLASH 10MHZ 16-TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QG8CDTE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 12
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-TSSOP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 20MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 512Byte
• # I/os (max): 12
• Number Of Timers - General Purpose: 1
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 16
• Package Type: TSSOP
• Processor Series: S08QG
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 1
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08QG8E
• Minimum Operating Temperature: - 40 C
• Package: 16TSSOP
• Family Name: HCS08
• Maximum Speed: 20 MHz
• For Use With: DEMO9S08QG8E - BOARD DEMO FOR MC9S08QG8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Chapter 1
Device Overview
1.1
The MC9S08QG8 is a member of the low-cost, high-performance HCS08 Family of 8-bit microcontroller
units (MCUs). All MCUs in the family use the enhanced HCS08 core and are available with a variety of
modules, memory sizes, memory types, and package types. Refer to
each device in this series.
1.1.1
Table 1-1
Freescale Semiconductor
Package
Package
Feature
I/O pins
FLASH
XOSC
ACMP
MTIM
Types
RAM
DBG
ADC
TPM
IRQ
ICS
SCI
KBI
SPI
IIC
Introduction
summarizes the features available in the MC9S08QG8/4 series of MCUs.
Devices in the MC9S08QG8/4 Series
1 Output
24 QFN
1 Input
24-Pin
12 I/O
8-pin
8-ch
2-ch
only
only
yes
yes
yes
1 Output only
1 Input only
16 TSSOP
Table 1-1. Devices in the MC9S08QG8/4 Series
16 PDIP
16 QFN
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 5
MC9S08QG8
16-Pin
12 I/O
8-pin
8-ch
2-ch
yes
yes
yes
512
yes
yes
yes
yes
yes
yes
8K
1 Output only
1 Input only
8 SOIC
8 DFN
8-Pin
4-pin
4 I/O
4-ch
1-ch
no
no
no
Device
1 Output only
1 Input only
24 QFN
24-Pin
12 I/O
8-pin
8-ch
2-ch
yes
yes
yes
yes
Table 1-1
1 Output only
MC9S08QG4
1 Input only
16 TSSOP
16 QFN
16-Pin
12 I/O
for features associated with
8-pin
8-ch
2-ch
yes
yes
yes
yes
256
yes
yes
yes
yes
yes
4K
1 Output only
1 Input only
8 SOIC
8 PDIP
8 DFN
8-Pin
4-pin
4 I/O
4-ch
1-ch
yes
no
no
no
19