MC9S08QG8CDTE Freescale Semiconductor, MC9S08QG8CDTE Datasheet - Page 214

• Manufacturer Part Number: MC9S08QG8CDTE
• Description: IC MCU 8K FLASH 10MHZ 16-TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QG8CDTE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 12
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-TSSOP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 20MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 512Byte
• # I/os (max): 12
• Number Of Timers - General Purpose: 1
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 16
• Package Type: TSSOP
• Processor Series: S08QG
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 1
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08QG8E
• Minimum Operating Temperature: - 40 C
• Package: 16TSSOP
• Family Name: HCS08
• Maximum Speed: 20 MHz
• For Use With: DEMO9S08QG8E - BOARD DEMO FOR MC9S08QG8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

V
V
SS
DD
Chapter 15 Serial Peripheral Interface (S08SPIV3)
212
NOTES:
1
2
3
4
5
6
7
8
9
Not all pins or pin functions are available on all devices, see
Port pins are software configurable with pullup device if input port.
Port pins are software configurable for output drive strength.
Port pins are software configurable for output slew rate control.
IRQ contains a software configurable (IRQPDD) pullup device if PTA5 enabled as IRQ pin function (IRQPE = 1).
RESET contains integrated pullup device if PTA5 enabled as reset pin function (RSTPE = 1).
PTA4 contains integrated pullup device if BKGD enabled (BKGDPE = 1).
SDA and SCL pin locations can be repositioned under software control (IICPS), defaults on PTA2 and PTA3.
When pin functions as KBI (KBIPEn = 1) and associated pin is configured to enable the pullup device, KBEDGn can be used to reconfigure
the pullup as a pulldown device.
(MC9S08QG8 = 8192 BYTES)
(MC9S08QG8 = 512 BYTES)
HCS08 SYSTEM CONTROL
(MC9S08QG4 = 4096 BYTES)
LOW-POWER OSCILLATOR
RESETS AND INTERRUPTS
16-MHz INTERNAL CLOCK
(MC9S08QG4 = 256 BYTES)
MODES OF OPERATION
VOLTAGE REGULATOR
POWER MANAGEMENT
CPU
IRQ
RTI
31.25 kHz to 38.4 kHz
1 MHz to 16 MHz
SOURCE (ICS)
HCS08 CORE
USER FLASH
USER RAM
V
V
V
V
(XOSC)
DDA
SSA
REFH
REFL
Figure 15-1. MC9S08QG8/4 Block Diagram Highlighting SPI Block and Pins
BDC
COP
LVD
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 5
SERIAL COMMUNICATIONS
INTERFACE MODULE (SCI)
INTERRUPT MODULE (KBI)
INTERFACE MODULE (SPI)
ANALOG COMPARATOR
DEBUG MODULE (DBG)
8-BIT MODULO TIMER
ANALOG-TO-DIGITAL
SERIAL PERIPHERAL
CONVERTER (ADC)
16-BIT TIMER/PWM
8-BIT KEYBOARD
IIC MODULE (IIC)
MODULE (MTIM)
MODULE (TPM)
(ACMP)
10-BIT
Table 1-1
EXTAL
XTAL
for available functions on each device.
ACMPO
ACMP–
ACMP+
TxD
RxD
TPMCH0
TPMCH1
4
4
SDA
4
4
BKGD/MS
SCL
IRQ
SPSCK
TCLK
SS
MISO
MOSI
PTA5//IRQ/TCLK/RESET
PTA4/ACMPO/BKGD/MS
PTA3/KBIP3/SCL/ADP3
PTA2/KBIP2/SDA/ADP2
PTA1/KBIP1/ADP1/ACMP–
PTA0/KBIP0/TPMCH0/ADP0/ACMP+
PTB7/SCL/EXTAL
PTB6/SDA/XTAL
PTB5/TPMCH1/SS
PTB4/MISO
PTB3/KBIP7/MOSI/ADP7
PTB2/KBIP6/SPSCK/ADP6
PTB1/KBIP5/TxD/ADP5
PTB0/KBIP4/RxD/ADP4
Freescale Semiconductor