MC9S08QG8CDTE Freescale Semiconductor, MC9S08QG8CDTE Datasheet - Page 278

• Manufacturer Part Number: MC9S08QG8CDTE
• Description: IC MCU 8K FLASH 10MHZ 16-TSSOP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QG8CDTE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 12
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-TSSOP
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 20MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 512Byte
• # I/os (max): 12
• Number Of Timers - General Purpose: 1
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 16
• Package Type: TSSOP
• Processor Series: S08QG
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 1
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08QG8E
• Minimum Operating Temperature: - 40 C
• Package: 16TSSOP
• Family Name: HCS08
• Maximum Speed: 20 MHz
• For Use With: DEMO9S08QG8E - BOARD DEMO FOR MC9S08QG8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Appendix A Electrical Characteristics
A.8
This section describes timing characteristics for each peripheral system.
A.8.1
1
2
3
4
5
276
Bus frequency (t
Real-time interrupt internal oscillator period
External reset pulse width
IRQ pulse width
KBIPx pulse width
Port rise and fall time (load = 50 pF)
BKGD/MS setup time after issuing background debug force
reset to enter user or BDM modes
BKGD/MS hold time after issuing background debug force
reset to enter user or BDM modes
Data in Typical column was characterized at 3.0 V, 25°C.
This is the shortest pulse that is guaranteed to be recognized.
This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or
may not be recognized. In stop mode, the synchronizer is bypassed so shorter pulses can be recognized in that case.
Timing is shown with respect to 20% V
To enter BDM mode following a POR, BKGD/MS should be held low during the power-up and for a hold time of t
rises above V
Slew rate control enabled (PTxSE = 1)
Slew rate control disabled (PTxSE = 0)
Asynchronous path
Synchronous path
Asynchronous path
Synchronous path
AC Characteristics
Control Timing
LVD
cyc
.
= 1/f
3
3
2
2
Bus
Parameter
2
)
5
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 5
4
DD
and 80% V
Table A-9. Control Timing
DD
levels. Temperature range –40°C to 85°C.
t
t
Symbol
ILIH,
Rise
t
t
MSSU
t
t
f
extrst
t
MSH
ILIH
Bus
RTI
, t
t
IHIL
Fall
1.5 t
1.5 t
Min
700
100
100
100
500
100
—
—
0
cyc
cyc
Typ
1000
30
—
—
—
—
—
—
3
1
Freescale Semiconductor
1300
Max
10
—
—
—
—
—
—
—
MSH
after V
MHz
Unit
μs
ns
ns
ns
ns
ns
μs
DD