C8051F988-GM Silicon Laboratories Inc, C8051F988-GM Datasheet - Page 45

• Manufacturer Part Number: C8051F988-GM
• Description: IC MCU 8BIT 4KB FLASH 24QFN
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F9xxr

Specifications of C8051F988-GM

• Program Memory Type: FLASH
• Program Memory Size: 4KB (4K x 8)
• Package / Case: 24-UQFN Exposed Pad, 24-HUQFN
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: SMBus (2-Wire/I²C), SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
• Number Of I /o: 17
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051F9x
• Core: 8051
• Data Ram Size: 512 B
• Interface Type: I2C, SMBus, Enhanced UART, Enhanced SPI
• Maximum Clock Frequency: 7 KHz
• Number Of Programmable I/os: 17
• Number Of Timers: 4
• Operating Supply Voltage: 2.4 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F996DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 10 Channel
• On-chip Dac: 10 bit, 4 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1959-5

Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
the solder mask and the metal pad is to be 60 µm minimum, all the way around
the pad.
should be used to assure good solder paste release.
specification for Small Body Components.
Dimension
C
E
X
Y
Figure 3.9. QSOP-24 Landing Diagram
Table 3.7. PCB Land Pattern
Rev. 1.0
5.20
0.30
1.50
MIN
C8051F99x-C8051F98x
0.635 BSC
MAX
5.30
0.40
1.60
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