AT91SAM9263B-CU Atmel, AT91SAM9263B-CU Datasheet - Page 1056

• Manufacturer Part Number: AT91SAM9263B-CU
• Description: IC ARM9 MCU 200 MHZ 324-TFBGA
• Manufacturer: Atmel
• Series: AT91SAMr

Specifications of AT91SAM9263B-CU

• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 240MHz
• Connectivity: CAN, Ethernet, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: AC'97, LCD, POR, PWM, WDT
• Number Of I /o: 160
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: ROM
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 1.08 V ~ 1.32 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 324-TFBGA
• Processor Series: AT91SAMx
• Core: ARM926EJ-S
• Data Bus Width: 32 bit
• Data Ram Size: 96 KB
• Interface Type: 2-Wire, EBI, I2S, MCI, SPI, USART
• Maximum Clock Frequency: 200 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: AT91SAM-ICE, AT91-ISP, AT91SAM9263-EK
• Minimum Operating Temperature: - 40 C
• Package: 324TFBGA
• Device Core: ARM926EJ-S
• Family Name: 91S
• Maximum Speed: 200 MHz
• Operating Supply Voltage: 1.8|2.5|3.3 V
• Controller Family/series: AT91SAM9xxx
• No. Of I/o's: 160
• Ram Memory Size: 96KB
• Cpu Speed: 240MHz
• No. Of Timers: 1
• Rohs Compliant: Yes
• For Use With: AT91SAM9263-EK - KIT EVAL FOR AT91SAM9263AT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: Q3735625

48. AT91SAM9263 Mechanical Characteristics
48.1
Table 48-1.
Table 48-2.
Table 48-3.
Table 48-4.
This package respects the recommendations of the NEMI User Group.
1056
Ball Land
Soldering Mask Opening
572
Moisture Sensitivity Level
JEDEC Drawing Reference
JESD97 Classification
Package Drawing
AT91SAM9263
Soldering Information
Device and 324-ball TFBGA Package Maximum Weight
324-ball TFBGA Package Characteristics
Package Reference
Figure 48-1. 324-ball TFBGA Package Drawing
mg
0.4 mm +/- 0.05
0.275 mm +/- 0.03
3
MO-210
e1
6249H–ATARM–27-Jul-09