AT91SAM9263B-CU Atmel, AT91SAM9263B-CU Datasheet - Page 238

• Manufacturer Part Number: AT91SAM9263B-CU
• Description: IC ARM9 MCU 200 MHZ 324-TFBGA
• Manufacturer: Atmel
• Series: AT91SAMr

Specifications of AT91SAM9263B-CU

• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 240MHz
• Connectivity: CAN, Ethernet, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: AC'97, LCD, POR, PWM, WDT
• Number Of I /o: 160
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: ROM
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 1.08 V ~ 1.32 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 324-TFBGA
• Processor Series: AT91SAMx
• Core: ARM926EJ-S
• Data Bus Width: 32 bit
• Data Ram Size: 96 KB
• Interface Type: 2-Wire, EBI, I2S, MCI, SPI, USART
• Maximum Clock Frequency: 200 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: AT91SAM-ICE, AT91-ISP, AT91SAM9263-EK
• Minimum Operating Temperature: - 40 C
• Package: 324TFBGA
• Device Core: ARM926EJ-S
• Family Name: 91S
• Maximum Speed: 200 MHz
• Operating Supply Voltage: 1.8|2.5|3.3 V
• Controller Family/series: AT91SAM9xxx
• No. Of I/o's: 160
• Ram Memory Size: 96KB
• Cpu Speed: 240MHz
• No. Of Timers: 1
• Rohs Compliant: Yes
• For Use With: AT91SAM9263-EK - KIT EVAL FOR AT91SAM9263AT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: Q3735625

23.5
23.5.1
Figure 23-2. Write Burst, 32-bit SDRAM Access
SDRAMC_A[12:0]
23.5.2
6249H–ATARM–27-Jul-09
D[31:0]
SDWE
SDCS
SDCK
Functional Description
RAS
CAS
SDRAM Controller Write Cycle
SDRAM Controller Read Cycle
Row n
The SDRAM Controller allows burst access or single access. In both cases, the SDRAM control-
ler keeps track of the active row in each bank, thus maximizing performance. To initiate a burst
access, the SDRAM Controller uses the transfer type signal provided by the master requesting
the access. If the next access is a sequential write access, writing to the SDRAM device is car-
ried out. If the next access is a write-sequential access, but the current access is to a boundary
page, or if the next access is in another row, then the SDRAM Controller generates a precharge
command, activates the new row and initiates a write command. To comply with SDRAM timing
parameters, additional clock cycles are inserted between precharge/active (t
active/write (t
Configuration Register” on page
The SDRAM Controller allows burst access, incremental burst of unspecified length or single
access. In all cases, the SDRAM Controller keeps track of the active row in each bank, thus
maximizing performance of the SDRAM. If row and bank addresses do not match the previous
row/bank address, then the SDRAM controller automatically generates a precharge command,
activates the new row and starts the read command. To comply with the SDRAM timing param-
eters, additional clock cycles on SDCK are inserted between precharge and active commands
(t
uration register of the SDRAM Controller. After a read command, additional wait states are
generated to comply with the CAS latency (1, 2 or 3 clock delays specified in the configuration
register).
RP
) and between active and read command (t
t
RCD
= 3
col a
RCD
Dna
) commands. For definition of these timing parameters, refer to the
col b
Dnb
col c
Dnc
249. This is described in
col d
Dnd
col e
Dne
RCD
col f
Dnf
). These two parameters are set in the config-
col g
Dng
Figure 23-2
col h
Dnh
AT91SAM9263
col i
Dni
below.
col j
Dnj
RP
) commands and
col k
Dnk
“SDRAMC
col l
Dnl
238