AT91SAM9263B-CU Atmel, AT91SAM9263B-CU Datasheet - Page 867

• Manufacturer Part Number: AT91SAM9263B-CU
• Description: IC ARM9 MCU 200 MHZ 324-TFBGA
• Manufacturer: Atmel
• Series: AT91SAMr

Specifications of AT91SAM9263B-CU

• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 240MHz
• Connectivity: CAN, Ethernet, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: AC'97, LCD, POR, PWM, WDT
• Number Of I /o: 160
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: ROM
• Ram Size: 128K x 8
• Voltage - Supply (vcc/vdd): 1.08 V ~ 1.32 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 324-TFBGA
• Processor Series: AT91SAMx
• Core: ARM926EJ-S
• Data Bus Width: 32 bit
• Data Ram Size: 96 KB
• Interface Type: 2-Wire, EBI, I2S, MCI, SPI, USART
• Maximum Clock Frequency: 200 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: AT91SAM-ICE, AT91-ISP, AT91SAM9263-EK
• Minimum Operating Temperature: - 40 C
• Package: 324TFBGA
• Device Core: ARM926EJ-S
• Family Name: 91S
• Maximum Speed: 200 MHz
• Operating Supply Voltage: 1.8|2.5|3.3 V
• Controller Family/series: AT91SAM9xxx
• No. Of I/o's: 160
• Ram Memory Size: 96KB
• Cpu Speed: 240MHz
• No. Of Timers: 1
• Rohs Compliant: Yes
• For Use With: AT91SAM9263-EK - KIT EVAL FOR AT91SAM9263AT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: Q3735625

Figure 43-6. Data IN Transfer for Non Ping-pong Endpoint
43.5.2.4
867
USB Bus Packets
TXPKTRDY Flag
(UDP_CSRx)
TXCOMP Flag
(UDP_CSRx)
FIFO (DPR)
Content
AT91SAM9263
Using Endpoints With Ping-pong Attribute
Set by the firmware
Data IN
PID
Prevous Data IN TX
Data IN 1
Interrupt Pending
The use of an endpoint with ping-pong attributes is necessary during isochronous transfer. This
also allows handling the maximum bandwidth defined in the USB specification during bulk trans-
fer. To be able to guarantee a constant or the maximum bandwidth, the microcontroller must
prepare the next data payload to be sent while the current one is being sent by the USB device.
Thus two banks of memory are used. While one is available for the microcontroller, the other
one is locked by the USB device.
Figure 43-7. Bank Swapping Data IN Transfer for Ping-pong Endpoints
When using a ping-pong endpoint, the following procedures are required to perform Data IN
transactions:
Cleared by Hw
Data IN 1
Microcontroller
1 st Data Payload
2 nd Data Payload
3 rd Data Payload
DPR access by the firmware
ACK
PID
Load In Progress
Set by the firmware
Microcontroller Load Data in FIFO
Data IN
PID
Bank 0
Endpoint 1
Bank 1
Endpoint 1
Bank 0
Endpoint 1
Write
NAK
PID
Cleared by Firmware
USB Device
Data IN
PID
DPR access by the hardware
Bank 0
Endpoint 1
Bank 1
Endpoint 1
Bank 0
Endpoint 1
Read
Read and Write at the Same Time
Data is Sent on USB Bus
Data IN 2
Payload in FIFO
Data IN 2
USB Bus
Cleared by Hw
2 nd Data Payload
3 rd Data Payload
1 st Data Payload
Data IN Packet
Data IN Packet
Data IN Packet
6249H–ATARM–27-Jul-09
ACK
PID
Cleared by
Firmware
Interrupt
Pending