HD64F36912GFH Renesas Electronics America, HD64F36912GFH Datasheet - Page 359

• Manufacturer Part Number: HD64F36912GFH
• Description: IC H8 MCU FLASH 8K 32-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300H Tinyr

Specifications of HD64F36912GFH

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 12MHz
• Connectivity: I²C, SCI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 18
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 32-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

20.2.9
Table 20.11 Flash Memory Characteristics
V
Item
Programming time (per 128 bytes)*
Erase time (per block) *
Reprogramming count
Programming
CC
= 3.0 V to 5.5 V, V
Flash Memory Characteristics
Wait time after SWE
bit setting*
Wait time after PSU
bit setting*
Wait time after P bit
setting*
Wait time after P bit
clear*
Wait time after PSU
bit clear*
Wait time after PV
bit setting*
Wait time after
dummy write*
Wait time after PV
bit clear*
Wait time after SWE
bit clear*
Maximum
programming count*
1
SS
1
1
*
*
= 0.0 V, T
1
1
1
3
4
*
1
1
1
6
1
a
1
*
= –20°C to +75°C, unless otherwise specified.
1
2
*
*
4
4
*
5
Symbol
t
t
N
x
y
z1
z2
z3
N
P
E
WEC
Test
Condition
1
7
Additional-
programming
n
n
6
1000
Rev. 3.00 Sep. 14, 2006 Page 329 of 408
Section 20 Electrical Characteristics
Min.
—
—
1000 10000 —
1
50
28
198
8
5
5
4
2
2
100
—
Values
Typ.
7
100
—
—
30
200
10
—
—
—
—
—
—
—
REJ09B0105-0300
Max. Unit
200
1200 ms
—
—
32
202
12
—
—
—
—
—
—
1000 Times
ms
Times
µs
µs
µs
µs
µs
µs
µs
µs
µs
µs
µs